Abstract
Aimed at the low efficiencies of wire electrical discharge machining of high-resistance silicon, this paper proposes a procedure that also improves the efficiency of silicon crystal discharge cutting, that is, the use of electroless copper plating on the silicon surface. A semiconductor equivalent discharge circuit model was established, the current–voltage characteristics of silicon crystals under different power feeding methods were studied, and the processing performances of different power feeding methods of silicon were compared. The test results show that electroless copper plating can significantly reduce the contact resistance of silicon and total resistance of the loop and increase the processing current. When the voltage is 160 V, the processing efficiency of the copper foil increases by 73%, while its surface roughness and width also slightly increase.
Similar content being viewed by others
Availability of data and materials
The data in the paper is real and usable.
References
Pei ZJ, Kassir S, Bhagavat M, Fisher GR (2004) An experimental investigation into soft-pad grinding of wire-sawn silicon wafers. Int J Mach Tool Manuf 44(2–3):299–306
Wang YL, Ye JY (2011) Review and development of crystalline silicon solar cell with intelligent materials. Adv Mater Res 321:196–199
Rakwal D, Bamberg E (2009) Slicing, cleaning and kerf analysis of germanium wafers machined by wire electrical discharge machining. J Mater Process Technol 209:3740–3751
Li WT, Liu H, Chen HL (2004) Summary of the development of solar photovoltaic power generation at home and abroad. Qinghai Electr Power 23(04):3–6
Zhao JC, Qiu MB, Yan J, Lu P, Qin Y, Chen ZB (2020) Research on the machining characteristics of composite pulse power supply for the electrical discharge machining of semiconductor silicon crystal. Int J Adv Manuf Technol 111(7–8):1–13
Bamberg E, Rakwal D (2008) Experimental investigation of wire electrical discharge machining of gallium-doped germanium. J Mater Process Technol 197(1–3):419–427
Bhagavat S, Kao I (2007) Ultra-low load multiple indentation response of materials: in purview of wiresaw slicing and other free abrasive machining (FAM) processes. Int J Mach Tool Manuf 47(3–4):666–672
Jiang RH, Xiao SZ (2001) The development status of semiconductor silicon materials in China. Semicond Intell 38(6):31–35
Zhou WW, Liu ZD, Zhang B, Qiu MB, Chen HR, Shen LD (2018) Experimental research on semiconductor shaping by abrasive-spark hybrid machining. Int J Adv Manuf Technol 94:2209–2216
Lu ZS, Wang MH (2003) Summary of research on ultra-fine close cutting theory of hard and brittle optical crystal materials. Chin J Mech Eng-En 39(8):15–21
Sreejith PS, Udupa G, Noor YBM, Ngoi BKA (2001) Recent advances in machining of silicon wafers for semiconductor applications. Int J Adv Manuf Technol 17(3):157–162
Hardin CW, Qu J, Shih AJ (2004) Fixed abrasive diamond wire saw slicing of single-crystal silicon carbide wafers. Mater Manuf Process 19(2):355–367
Qiu MB, Huang YH, Liu ZD, Tian ZJ, Wang W (2008) The current state of solar wafer manufacturing methods. Mech Sci Technol 27(08):1017–1020
Muthuramalingam T, Mohan B (2015) A review on influence of electrical process parameters in EDM process. Arch Civ Mech Eng 15(1):87–94
Luo Y, Chen C, Tong Z (1992) Investigation of silicon wafering by wire EDM. J Mater Sci 27(21):5805–5810
Kawata K, Masaki T, Sato T, Masuzawa T (1994) Study on micro-EDM (3rd Report) Fabrication of micro-mecancial elements. J Jpn Soc Electr Mach Eng 28(59):1–10
Reynaerts D, Heeren P-H, Brussel HV (1997) Microstructuring of silicon by electro-discharge machining (EDM) — part I: theory. Sensor Actuators A Phys 60(1):212–218
Zhang Y, Zhang GY, Wang ZL, Zhao WS (2008) Micro electrical discharge machining techniques of semiconducting silicon material. J Harbin Inst Technol 40(11):1736–1740
Wang ZL, Xia LJ, Zhao WS (2004) Research on the electric spark processing technology of semiconductor silicon materials. Electromach Mould 01:13–16
Wang ZL, Xia LJ, Zhao WS (2003) Research on the electric spark processing technology of semiconductor silicon materials. The 10th National Special Processing Academic Conference (04)
Peng WY, Liao YS (2003) Study of electrical discharge machining technology for slicing silicon ingots. J Mater Process Technol 140(1–3):274–279
Qiu MB (2010) Research on electrical discharged machining of semiconductor crystal materials. Nanjing University of Aeronautics and Astronautics the Graduate School College of Mechanical and Electronic Engineering
Hu YW, Liu ZD, Qiu MB, Wang W, Tian ZJ, Bi Y, Huang YH (2010) Effect of contact materials and pressure on contact resistance in discharge machining of semiconductors. Mech Sci Technol Aerospace Eng 29(08):1089–1093
Zhang X, Li D, Zhao JF, Xie DQ, Liang HX, Shen LD, Tian ZJ (2020) Research on structural circuit integration technology based on selective laser sintering. J Nanjing Univ Aeronaut Astronaut 52(01):87–92
Shao CJ (2020) Research on EDM of silicon crystals based on closed-loop pulse power source. Nanjing University of Aeronautics and Astronautics the Graduate School College of Mechanical and Electronic Engineering
Qiu MB, Huang YH, Liu ZD, Tian ZJ, Wang W (2008) Basic study on body resistance of solar silicon with different conduction mode. Electromach Mould 04:24–28
Hamoudi WK, Ali ROD (2000) Laser induced diffusion of indium in silicon. J Mater Sci 35(23):5951–5956
Acknowledgements
We thank all the individuals who contributed to this manuscript.
Funding
This work is supported by the National Key Laboratory of Science and Technology on Helicopter Transmission (Nanjing University of Aeronautics and Astronautics) (Grant No. HTL-A-20G05). This work is supported by the National Natural Science Foundation of China (Grant No. 51675272).
Author information
Authors and Affiliations
Contributions
Zhibin Chen and Mingbo Qiu completed the experiment; Zhao Jinchao was in charge of part of the experiment; Qin Yan, Chuangchuang, Guo and Rong Wan were in charge of data sorting.
Corresponding author
Ethics declarations
Ethics approval
Agree to ethical approval.
Consent to participate
Agree to participate.
Consent for publication
Agree to publish.
Competing interests
The authors declare no competing interests.
Additional information
Publisher's Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Zhibin Chen and Mingbo Qiu contributed equally to this work and are the co-first authors.
Rights and permissions
About this article
Cite this article
Chen, Z., Qiu, M., Zhao, J. et al. Research on improving the discharge cutting efficiency of N-type high-resistance silicon based on electroless plating. Int J Adv Manuf Technol 119, 5839–5850 (2022). https://doi.org/10.1007/s00170-021-08240-7
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s00170-021-08240-7