Abstract
Surface machined by high-speed wire electrical discharge machining (HS-WEDM) at super-high thickness (more than 1000 mm) cutting suffers from uneven surface, a major problem that has been investigated in this paper. According to the analysis, as wire frame span increases, the rigidity of the wire electrode decreases, and under the action of discharge explosive force, wire electrode vibration intensifies. As a result, the machining stability inevitably decreases. However, the core problem is whether there is enough working fluid in the slit to dampen and absorb the vibration of the wire electrode so as to ensure the positional stability of the wire electrode. To verify the above point of view: first, the wire guide and gravity take-up with bidirectional tension in the wire feeding system were installed to improve the positional accuracy of the wire electrode; second, to improve the flow of the working fluid into the slit, the slit width was increased by improving the working fluid and a medium carrier with a higher melting point and vaporization point can reduce the vaporization of the working fluid in the slit as much as possible. The experiment showed that the outlet flow of the improved working fluid is 56.72% higher than that of the original working fluid when cutting a 750-mm thick workpiece, which increases the damping and vibration absorption effect of the working fluid on the wire electrode in the long and narrow gap. After the above measures were implemented, super-high thickness cutting can be carried out continuously and steadily, the surface evenness was significantly improved, and the workpiece with a thickness of 2000 mm was cut successfully.
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The authors extend their sincere thanks to those who contributed in the preparation of the instructions.
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This work was supported by the National Natural Science Foundation of China (Grant No.51975290).
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Deng, C., Liu, Z., Zhang, M. et al. Study on surface evenness of super-high-thickness cutting in high-speed wire electrical discharge machining. Int J Adv Manuf Technol 117, 3705–3715 (2021). https://doi.org/10.1007/s00170-021-07919-1
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DOI: https://doi.org/10.1007/s00170-021-07919-1