Abstract
Diamond wire sawing has gradually applied as the dominant way of silicon sawing in the photovoltaic and semiconductor industry. In this paper, a model of stiffness of wire web was established, and the corresponding test measure, process, and evaluation standard were proposed. Lack of stiffness of wire web could easily cause wire bow and further reduce the machining accuracy during diamond wire sawing. And the machining accuracy due to wire bow was analyzed. The special significance of this study is considered the stiffness of wire web to be the key index of multi-wire sawing performance. Through this method, the wire bow and the lack of cutting accuracy can be reasonably evaluated. As a result, wire lag and wire bow due to the loss of the stiffness of wire web could be minimized, as well as its influence on machining accuracy. Static stiffness matrices of wire web were presented to analyze the influence of the feed position and the number of wires forming the wire web on the stiffness of wire web. Moreover, a FEM model was established to find the influence factors such as wheel span, wheel diamond, and preset tension on the stiffness of wire web.
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Acknowledgements
The authors acknowledge the support provided by the Development and Construction Fund of National Independent Innovation Demonstration Zone of Shandong Peninsula, Shandong, China, by allowing the facilities to conduct this work.
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This work was supported by the National Independent Innovation Demonstration Zone of Shandong Peninsula, Shandong, China.
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Jian Qiu: Conceptualization, methodology, data curation, investigation, formal analysis, supervision, writing-original draft, and visualization. Shanbao Zhang and Renpeng Ge: Validation. Guodong Yang and Rilai Fu: Software. He Zhu: Investigation. Yingkui Zou: Equipment.
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Qiu, J., Zhang, S., Fu, R. et al. Investigation on the stiffness of wire web of multi-wire sawing machine and its influence on machining accuracy. Int J Adv Manuf Technol 117, 985–995 (2021). https://doi.org/10.1007/s00170-021-07788-8
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DOI: https://doi.org/10.1007/s00170-021-07788-8