Skip to main content
SpringerLink
Log in

Research on a novel fabricating method of diamond grinding tool with defined grain arrangement

  • ORIGINAL ARTICLE
  • Published:
The International Journal of Advanced Manufacturing Technology Aims and scope Submit manuscript

Abstract

Grain-arranged grinding tool refers to a kind of grinding tool in which the position of abrasive grains on grinding tool can be controlled artificially. In this paper, a new method for fabrication of grain-arranged grinding tool is proposed, which is to directly coat the mask material (UV ink) on the metal substrate, and then by combining laser ablation and grain electroplating technology, the grinding tool with orderly arrangement of abrasive grains can finally be obtained. For the proposed fabrication method, the fabrication process is introduced in detail, mainly including the relationship between laser ablation parameters and the ablated mask hole depth, and the relationship between mask hole aspect ratio and the morphology of the plated layer in the mask hole. It is found that for laser ablation of UV ink, the critical laser power to remove the UV ink is 1.79 W, and the critical ablation threshold is 0.269 J/cm2. When the used laser power is 5.4–21 W, the relationship between laser power and the ablated hole depth is basically linear. For mask hole electroplating process, it is found that the unevenness of the plated layer in the mask hole and the growth rate of the plating layer increase with the decrease of the mask hole aspect ratio. By using the proposed method, grain-arranged grinding tool with 6 mm diameter, 95 μm grain size, and 150 μm grain spacing has been successfully fabricated, and its processing performance has been preliminarily validated by machining experiments.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12
Fig. 13
Fig. 14
Fig. 15
Fig. 16
Fig. 17
Fig. 18
Fig. 19

Similar content being viewed by others

Abbreviations

D :

The ablated hole diameter

h :

Height of the laser-ablated hole

D 0.2 :

Diameter size at the hole height of h/5

K :

Slope of the hole contour at the height of 4h/5

ω 0 :

Diameter of laser beam waist

φ 0 :

Center energy density of the laser beam

E p :

Energy of single laser pulse

P :

Laser power

f :

Frequency of laser pulse

f s :

Sampling frequency of the dynamometer

φ th :

The critical energy density that causes permanent damage to material

l :

Distance laser scans

v :

Laser scanning speed

E l :

Energy outputted by the laser

E i :

Energy actually absorbed by the one ablation mask hole

α :

Energy input coefficient

E c :

Heat conduction energy

E r :

Activation energy

T m :

Critical transition temperature of the gasification of the material

T a :

The ambient temperature

E r1, E r2 :

Energy consumed in the first and the second reaction stages

ρ :

Density of the mask material

M :

Average molar mass of mask layer material

F :

Faraday constant

▽c :

Concentration gradient of the plating solution above the plated surface

A :

Cross-sectional area of the plating system

R i :

Air constant

T s :

Plating solution temperature

ψ i :

Potential gradient of the plating solution above the plated surface

h c :

Thickness of the plated layer in the mask hole

s d :

Thickness different of the plated layer in the mask hole

J d, J c, J e :

Current density caused by diffusion, convection, and electromigration, respectively

z B :

Ionic charge of substance B

v c :

Flow velocity of the plating solution

c :

Molar concentration of substance B

r s :

Thickness of the Nernst diffusion layer

r o1 :

Aspect ratio of the ablation mask hole

r o1, r o2 :

Mask hole aspect ratios less than 1 and greater than 1, respectively

N :

The number of holes ablated within the distance l

References

  1. Malkin S, Guo C (2008) Grinding technology: theory and application of machining with abrasives. McGraw-Hill USA.

  2. Rowe WB (2013) Principles of modern grinding technology. Elsevier Science Netherlands.

  3. Brinksmeier E, Heinzel C, Wittmann M (1999) Friction, cooling and lubrication in grinding. CIRP Ann Manuf Technol 48(2):581–598

    Article  Google Scholar 

  4. Nadolny K (2015) Small-dimensional sandwich grinding wheels with a centrifugal coolant provision system for traverse internal cylindrical grinding of steel 100Cr6. J Clean Prod 93:354–363

    Article  Google Scholar 

  5. Malkin S, Guo C (2007) Thermal analysis of grinding. CIRP Ann Manuf Technol 56(2):760–782

    Article  Google Scholar 

  6. Kim JD, Kang YH, Jin DX, Lee YS (1997) Development of discontinuous grinding wheel with multi-porous grooves. Int J Mach Tools Manuf 37(11):1611–1624

    Article  Google Scholar 

  7. Butler-Smith PW, Axinte DA, Daine M (2009) Preferentially oriented diamond micro-arrays: a laser patterning technique and preliminary evaluation of their cutting forces and wear characteristics. Int J Mach Tools Manuf 49(15):1175–1184

    Article  Google Scholar 

  8. Butler-Smith PW, Axinte DA, Daine M (2011) Ordered diamond micro-arrays for ultra-precision grinding – an evaluation in Ti–6Al–4V. Int J Mach Tools Manuf 51(1):54–66

    Article  Google Scholar 

  9. Qu M, Jin T, Xie G (2020) Design of binderless grinding wheel with positive rake angle and fabrication used femtosecond laser ablation for grinding soft and brittle crystals. Opt Lasers Eng 124(Jan.):105803.1–105803.9

    Google Scholar 

  10. Burkhard G, Rehsteiner F, Schumacher B (2002) High efficiency abrasive tool for honing. CIRP Ann Manuf Technol 51(1):271–274

    Article  Google Scholar 

  11. Pinto FW (2008) An experimental and numerical approach to investigate the machining performance of engineered grinding tools (Ph.D. thesis). ETH Zürich Zürich Switzerland.

  12. Pinto FW, Vargas GE, Wegener K (2008) Simulation for optimizing grain pattern on engineered grinding tools. CIRP Ann Manuf Technol 57(1):353–356

    Article  Google Scholar 

  13. Sung CM (1998) Brazed beads with a diamond grid for wire sawing. Ind Diam Rev 4(98):134–136

    Google Scholar 

  14. Sung CM (1999) Brazed diamond grid: a revolutionary design for diamond saws. Diam Relat Mater 8(8–9):1540–1543

    Article  Google Scholar 

  15. Wu S, Zhang F, Ni Y (2020) Grinding of alumina ceramic with microtextured brazed diamond end grinding wheels. Ceram Int 46:12

    Google Scholar 

  16. Ding WF, Dai CW, Yu T, Xu JH, Fu YC (2017) Grinding performance of textured monolayer CBN tools: undeformed chip thickness nonuniformity modeling and ground surface topography prediction. Int J Mach Tools Manuf 122:66–80

    Article  Google Scholar 

  17. Chen J, Xu X (2014) Tribological characteristics in high-speed grinding of alumina with brazed diamond tools. Int J Adv Manuf Technol 71(9-12):1579–1585

    Article  Google Scholar 

  18. Ding WF, Xu HJ, Shen M (2007) Development and performance of monolayer brazed CBN grinding tools. Int J Adv Manuf Technol 34(5-6):491–495

    Article  Google Scholar 

  19. Li QL, Xu JH, Su HH (2015) Fabrication and performance of monolayer brazed CBN wheel for high-speed grinding of superalloy. Int J Adv Manuf Technol 80(5-8):1173–1180

    Article  Google Scholar 

  20. Zhang B, Xu HJ, Fu YC (2010) Development of high performance monolayer brazed diamond grinding tool for ceramics. Adv Mater Res 135:388–392

    Article  Google Scholar 

  21. Yang ZB, Liu AJ, Xu JH (2010) Laser brazing diamond grinding wheel with Ni-base filler alloy. Adv Mater Res 139-141:218–221

    Article  Google Scholar 

  22. Chen CS, Tang JY, Chen HF (2018) An active manufacturing method of surface micro structure based on ordered grinding wheel and ultrasonic-assisted grinding. Int J Adv Manuf Technol 97:1627–1635

    Article  Google Scholar 

  23. Wiand RC (1993) Abrasive sheet and method. U.S. Patent No. 5, 208, 881.

  24. DeKok PT, Tselesin NN (1990) Abrasive tool and method for making. USA US 4925457: 1990-5-15.

  25. DeKok PT, Tselesin NN (1992) Abrasive tool and method for making. USA US 5092910: 1992-3-3.

  26. Huang G, Wang Y, Zhang M (2020) Brazing diamond grits onto AA7075 aluminium alloy substrate with Ag–Cu–Ti filler alloy by laser heating. Chinese J Aeronaut

  27. Long WM, Liu DA, Wu AP (2020) Influence of laser scanning speed on the formation property of laser brazing diamond coating. Diam Relat Mater 110:108085

    Article  Google Scholar 

  28. Lu YS, Wang J, Liu YM, Xing XL (2014) Development of a novel polishing pad with a phyllotactic pattern, and experimental studies. J Electron Mater 43(7):2738–2746

    Article  Google Scholar 

  29. Liu ZZ, Wang J, Lu YS, Ma F, Xiang L, Zhang S (2015) Fabrication of the electroplated CBN wheel for cylindrical grinding with abrasive phyllotactic pattern. Adv Mater Res 1077:44–49

    Article  Google Scholar 

  30. Yu H, Lu YS, Wang J (2016) Study on wear of the grinding tool with an abrasive phyllotactic pattern. Wear 358:89–96

    Article  Google Scholar 

  31. Ding HB, Hang JQ, Cai P (2011) Thermal degradation of DGEBA/EDA epoxy resin. Polym Mater Sci Eng 027(002):83–85

    Google Scholar 

  32. Kuang Z, Perrie W, Liu D (2012) Ultrashort pulse laser patterning of indium tin oxide thin films on glass by uniform diffractive beam patterns. Appl Surf Sci 258(19):7601–7606

    Article  Google Scholar 

  33. Yilbas BS, Abdul-Aleem BJ (2006) Dross formation during laser cutting process. J Phys D Appl Phys 39(7):1451–1461

    Article  Google Scholar 

  34. Gramham AK (1971) Electroplating engineering handbook (third ed.). Van Norstrand Reihold Co New York.

  35. Bard AJ, Faulkner LR (1980) Electrochemical methods: fundamentals and applications, 1st ed. J Chem Educ 60.

  36. Mehdizadeh S, Dukovic J, Andricacos PC (1993) The influence of lithographic patterning on current distribution in electrodeposition: experimental study and mass-transfer effects. J Electrochem Soc 140(12):3497–3505

    Article  Google Scholar 

  37. Edward HC (1984) Mass transfer analysis of electrodeposition through polymeric masks. J Electrochem Soc 131(6):1251

    Article  Google Scholar 

  38. Hasegawa M, Negishi Y, Nakanishi T (2005) Effects of additives on copper electrodeposition in submicrometer trenches. J Electrochem Soc 152(4):C221

    Article  Google Scholar 

Download references

Availability of data and materials

All data generated or analyzed during this study are included in this submitted article.

Funding

This work was supported by the National Natural Science Foundation of China (Grant Number 51575096) and the China Fundamental Research Funds for the Central Universities (Grant Number N180304014).

Author information

Authors and Affiliations

  1. Advanced Manufacturing Institute, Northeastern University, P.O. Box 319, Shenyang, 110004, China

    Jun Cheng, Jun Wu, Zhaozhi Guo, Chunchun Gao & Tao Yu

Authors
  1. Jun Cheng
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Jun Wu
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Zhaozhi Guo
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Chunchun Gao
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Tao Yu
    View author publications

    You can also search for this author in PubMed Google Scholar

Contributions

Jun Cheng contributed to the conception of the study, Jun Wu performed the data analyses and wrote the manuscript, Zhaozhi Guo performed the experiment, and Chunchun Gao and Tao Yu helped perform the analysis with constructive discussions.

Corresponding author

Correspondence to Jun Cheng.

Ethics declarations

Ethics approval

Not applicable.

Consent to participate

Not applicable.

Consent for publication

The author confirms the publication of this paper has been approved by all co-authors and its publication has been approved by the responsible authorities at the institution where the work is carried out.

Competing interests

The authors declare no competing interests.

Additional information

Publisher’s note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Cheng, J., Wu, J., Guo, Z. et al. Research on a novel fabricating method of diamond grinding tool with defined grain arrangement. Int J Adv Manuf Technol 115, 2233–2253 (2021). https://doi.org/10.1007/s00170-021-07199-9

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s00170-021-07199-9

Keywords

Search

Navigation