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Investigation of direct metal laser sintering downskin parameters’ sagging effect on microchannels

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Abstract

Additive manufacturing technology is an innovative and advantageous production technology in producing microchannels, heat exchangers designed in complex geometries. Process parameters developed to provide production standardization and quality standards on production results are known. The study investigates the sagging effect of downskin parameters on the downfacing surfaces of microchannels designed in different geometries. In this context, the productions and SEM examinations and the geometric corrections obtained with the developed parameter sets are shared with tables and graphic studies. The direct metal laser sintering (DMLS) method was used in the parameter and production studies within the study’s scope.

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Funding

This study was prepared within the scope of “ALUTEAM-Aluminum Test Training and Research Center,” carried out by Fatih Sultan Mehmet Vakif University.

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Authors and Affiliations

  1. Aluminium Test, Training and Research Center (ALUTEAM), Fatih Sultan Mehmet Vakif University, Halic Campus, Beyoglu, TR 34445, Istanbul, Turkey

    Cemal İrfan Çalışkan, Gökhan Özer, Mert Coşkun & Ebubekir Koç

Authors
  1. Cemal İrfan Çalışkan
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  2. Gökhan Özer
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  3. Mert Coşkun
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  4. Ebubekir Koç
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Contributions

Cemal İrfan Çalışkan: Design process, experimental, discussion result section authorship, CAD modeling, and table studies; Dr. Gökhan Özer: literature authorship, SEM laboratory works, editorial, and translation; Mert Coşkun: DMLS process parameter study, DMLS productions, literature study, and table studies; and Dr. Ebubekir Koç: coordinator.

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Correspondence to Cemal İrfan Çalışkan.

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The article follows the guidelines of the Committee on Publication Ethics (COPE) and involves no studies on human or animal subjects.

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The authors declare no competing interests.

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Çalışkan, C.İ., Özer, G., Coşkun, M. et al. Investigation of direct metal laser sintering downskin parameters’ sagging effect on microchannels. Int J Adv Manuf Technol 114, 2567–2575 (2021). https://doi.org/10.1007/s00170-021-07057-8

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