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Micro-milling/micro-EDM combined processing technology for complex microarray cavity fabrication

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Abstract

An integrated method of micro-milling and micro electrical discharge machining (EDM) is proposed for micro-structures array manufacture in this paper. In order to obtain micro-cavity array with high accuracy and consistency, in situ machining on the same coordinate system ensures the positioning precision. After studying micro-milling graphite, the effect of parameters on the machining accuracy is found. Further, suitable mode is chosen for high-dimensional consistency and good surface quality array electrodes according to comparison of one-by-one and layer-by-layer milling tool trajectory. Workpiece lifting control is used to strengthen the debris clear; then, it is verified beneficial of lifting through flow simulation and adding discrete particles. In order to solve poor precision of the micro-cavity contour caused by electrode wear, a multi-step machining by group electrodes is proposed, rough machining for material removal and finishing machining for trimming. Finally, a micro-cavity with clear edge, small fillets, and high shape accuracy is obtained. This method improves the machining performance of the array micro-structures and shows good prospects in micro-fabrication.

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Funding

This research work is funded by the National Natural Science Foundation of China (grant numbers 51675132, 51775145, and 52075130) and Major Project of Applied Technology Research and Development Plan of Heilongjiang Province (grant number GA16A404).

Author information

Authors and Affiliations

  1. School of Mechatronics Engineering, Harbin Institute of Technology, Harbin, 150001, Heilongjiang, China

    Han Wang, Yang Li, Xiang Chen, Yuchao Jia, Guanxin Chi, Yukui Wang & Zhenlong Wang

  2. Key Laboratory of Micro-systems and Micro-structures Manufacturing of Ministry of Education, Harbin Institute of Technology, Harbin, 150001, Heilongjiang, China

    Yukui Wang & Zhenlong Wang

  3. Department of Information Engineering, SEIEE Shanghai Jiao Tong University, No. 800 Dong Chuan Rd, Shanghai, China

    Xiang Chen

Authors
  1. Han Wang
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  2. Yang Li
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  3. Xiang Chen
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  4. Yuchao Jia
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  5. Guanxin Chi
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  6. Yukui Wang
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Contributions

Han Wang: Writing—original draft, writing—review and editing, and formal analysis

Yang Li: Methodology and visualization

Xiang Chen: Formal analysis

Yuchao Jia: Validation

Guanxin Chi: Software and resources

Yukui Wang: Investigation, funding acquisition, and supervision

Zhenlong Wang: Conceptualization, investigation, resources, funding acquisition, and project administration

Corresponding authors

Correspondence to Yukui Wang or Zhenlong Wang.

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The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

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There is no conflict of interest exists in the submission of this manuscript, and the manuscript is approved by all authors for publication. I would like to declare on behalf of my co-author that the work described was an original research that has not been published previously, and not under consideration for publication elsewhere, in whole or in part. All the authors listed have approved the manuscript that is enclosed. The results are clear and honest. We have ensured objectivity and transparency in research and ensured that accepted principles of ethical and professional conduct have been followed.

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Wang, H., Li, Y., Chen, X. et al. Micro-milling/micro-EDM combined processing technology for complex microarray cavity fabrication. Int J Adv Manuf Technol 113, 1057–1071 (2021). https://doi.org/10.1007/s00170-021-06674-7

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