Skip to main content
Log in

Fabrication and cutting performance of a new type of abrasives-helix-distribution saw wire for slicing KDP crystal

  • ORIGINAL ARTICLE
  • Published:
The International Journal of Advanced Manufacturing Technology Aims and scope Submit manuscript

Abstract

In the slicing process of KDP crystal, due to the characteristics of long sawing kerf length, low hardness, and easy cracking, etc., there is a high requirement for the lubrication and chip discharge performance of the sawing area during slicing. So there are higher requirements on the structure and cutting performance of the saw wire to improve the sawn surface accuracy and the stress distribution in the processing area to avoid crystal cracking. In this paper, based on the technical idea of orderly arrangement of abrasives on the surface of superhard abrasive tool, the fabrication process, surface structure parameters, and sawing performance of a new type of abrasives-helix-distribution electroplated saw wire for slicing KDP crystal are carried out. The manufacturing process of the abrasives-helix-distribution saw wire was established, and the electroplating process parameters were determined. The relationship between the surface structure parameters of the new type wire was analyzed, and the influences of different structural parameters on the cutting performance of the new type wire were studied; then, the reasonable combination of the surface structure parameters of the new type wire was determined. The results are helpful to further understand the influences of surface structure parameters on the sawing performance of the new type wire, and provide experimental basis and reference for the development of the abrasives-helix-distribution saw wire for slicing KDP crystal.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12
Fig. 13
Fig. 14
Fig. 15
Fig. 16

Similar content being viewed by others

References

  1. Chen M, Pang Q, Wang J, Cheng K (2008) Analysis of 3D microtopography in machined KDP crystal surfaces based on fractal and wavelet methods. Int J Mach Tool Manu 7-8:905–913

    Article  Google Scholar 

  2. Li Z, Ge P, Bi W, Liu T, Wang P, Gao Y (2018) Coupling stress caused by thermal and slicing force in KDP crystal slicing with fixed abrasive wire saw. Int J Adv Manuf Technol 96:4333–4343

    Article  Google Scholar 

  3. Ge M, Bi W, Ge P, Bi Y (2016) Experimental research on KDP crystal slicing with resin bonded diamond abrasive wire saw. Int J Adv Manuf Technol 87:1671–1676

    Article  Google Scholar 

  4. Chen N, Chen M, Guo Y, Wang X (2015) Effect of cutting parameters on surface quality in ductile cutting of KDP crystal using self-developed micro PCD ball end mill. Int J Adv Manuf Technol 78(1–4):221–229

    Article  Google Scholar 

  5. Ge M, Gao Y, Ge P, Jiao Y, Bi W (2017) A finite element analysis of sawing stress in fixed-abrasive wire saw slicing KDP crystal. Int J Adv Manuf Technol 91:2049–2057

    Article  Google Scholar 

  6. Zhang N, Zhang Q, Wang S, Sun Y (2011) Research on cutting effects of the large-size KDP crystal by numerical simulation method. J Synth Cryst 40(2):323–328

    Google Scholar 

  7. Jiao Y, Ge P, Gao Y (2014) Analysis of temperature and thermal stress distribution on KDP crystal wire saw slicing. Adv Mater Res 1027:28–31

    Article  Google Scholar 

  8. Deng L, Duan J, Zeng X (2013) A study on dual laser beam separation technology of KDP crystal. Int J Mach Tool Manu 72:1–10

    Article  Google Scholar 

  9. Martínez Krahmer D, Polvorosa R, López de Lacalle LN, Alonso-Pinillos U, Abate G, Riu F (2016) Alternatives for specimen manufacturing in tensile testing of steel plates. Exp Tech 40(6):1555–1565

    Article  Google Scholar 

  10. Gao Y, Ge P, Zhang L, Bi W (2019) Material removal and surface generation mechanisms in diamond wire sawing of silicon crystal. Mater Sci Semicond Process 103:104642

    Article  Google Scholar 

  11. Yin Y, Gao Y, Li X, Pu T, Wang L (2020) Experimental study on slicing photovoltaic polycrystalline silicon with diamond wire saw. Mater Sci Semicond Process 106:104779

    Article  Google Scholar 

  12. He Z, Huang H, Yin F, Xu X (2017) Development of a brazed diamond wire for slicing single-crystal SiC ingots. Int J Adv Manuf Technol 91:189–199

    Article  Google Scholar 

  13. Wang K, Jiang F, Yan L, Xu X, Wang N, Zha X, Lu X, Wen Q (2019) Study on mechanism of crack propagation of sapphire single crystals of four different orientations under impact load and static load. Ceram Int 45:7359–7375

    Article  Google Scholar 

  14. Li H, Gao Y, Ge P, Bi W, Zhang L (2020) Study on process parameters of fabrication fine diameter electroplated diamond wire for slicing crystalline silicon solar cell. Int J Adv Manuf Technol 106:3153–3175

    Article  Google Scholar 

  15. Gao Y, Ge PQ, Bi W, Bi Y (2013) Study on surface defects of KDP crystal sawed by diamond wire saw. J Synth Cryst 42:1278–1282

    Google Scholar 

  16. Li H, Wang J, Zheng L, Wang J, Shang P, Chen W, Liu F (2013) Study on cutting performance of electroplated three-core twisted diamond wire saw. Diam Abrasives Eng 33:67–70

    Google Scholar 

  17. Park C, Kweon H, Peng B, Jung B (2016) A study on new twist-diamond wire characteristics for improving processing performance. J Korean Soc Manuf Process Eng 15(1):26–33

    Google Scholar 

  18. Tian H (2019) Development of twisted pair resin bonded diamond wire saw. Dissertation, Shandong University

  19. Ortega N, Martynenko V, Perez D, Martínez Krahmer D, López de Lacalle LN, Ukar E (2020) Abrasive disc performance in dry-cutting of medium-carbon steel. Metals 10(4):538

    Article  Google Scholar 

  20. González H, Calleja A, Pereira O, Ortega N, López de Lacalle LN, Barton M (2018) Super abrasive machining of integral rotary components using grinding flank tools. Metals 8(1):24

    Article  Google Scholar 

  21. Jiang J, Sun S, Wang D, Yang Y (2020) Surface texture formation mechanism based on the ultrasonic vibration-assisted grinding process. Int J Mach Tool Manu 156:103595

    Article  Google Scholar 

  22. Meng J, Xiao B, Wang B, Yuan W (2014) Study on orderly arranged brazing diamond millstone disc. Diam Abrasives Eng 34:22–25

    Google Scholar 

  23. Guo G, Zhang F, Zhou Y (2013) Effect of the form for orderly arraying of cBN grits in monolayer brazed CBN grinding wheels on the surface roughness of workpieces. Superhard Mater Eng 25:1–5

    Google Scholar 

  24. Xiao L, Lin F, Chen C, Su Y, Cheng Y, Zhang L (2014) Influences of orderly arrangement on grinding performance of diamond grinding discs. Superhard Mater Eng 10:1–4

    Google Scholar 

  25. Liu T, Ge P, Bi W, Gao Y (2020) A new method of determining the slicing parameters for fixed diamond wire saw. Mater Sci Semicond Process 120:105252

    Article  Google Scholar 

  26. Teomete E (2011) Roughness damage evolution due to wire saw process. Int J Precis Eng Manuf 12(6):941–947

    Article  Google Scholar 

Download references

Funding

The work is financially supported by the National Natural Science Foundation of China (No. 51875322), Natural Science Foundation of Shandong Province, China (No. ZR2019MEE012), and Project for Scientific Research Innovation Team of Young Scholar in Colleges and Universities of Shandong Province (2020KJB001).

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Yufei Gao.

Additional information

Publisher’s note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Li, H., Gao, Y., Wang, L. et al. Fabrication and cutting performance of a new type of abrasives-helix-distribution saw wire for slicing KDP crystal. Int J Adv Manuf Technol 112, 2187–2199 (2021). https://doi.org/10.1007/s00170-020-06429-w

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s00170-020-06429-w

Keywords

Navigation