Abstract
Presented in 1996, maskless localized electrochemical deposition (LECD) is an emerging and unconventional manufacturing technology that originated from precision electroforming and electroplating. As a novel additive manufacturing technology, it forms a three-dimensional structure layer by layer at atomic scale. In this work, we present a review of the theoretical basis and key parameters of maskless LECD technology. LECD process, almost limited to linear structure-based depositions, is capable of creating structures with high aspect ratio up to 280. However, the degree of deposition accuracy is not satisfactory during the whole process. Besides, the deposition rate is rather slow and the highest deposition rate of 25 μm/s was reported in published literature. Moreover, not all metals can be deposited due to the limitations of the electrochemical discipline. For instance, the effects of interelectrode potential difference, interelectrode gap, scanning speed, electrolyte concentration, and energy field on the quality of maskless LECD were discussed. Although all parameters abovementioned have an effect on the deposition results, there is currently no optimization software that can calculate the optimal values in an effective manner. By combining different deposition structures, special tiny part systems can be generated or integrated into devices for tackling current and future challenges in some fields such as electronic circuits, microfluidics, communications, and biomedical aspect. Additionally, this work also introduces main hybrid variants of LECD. Possible future efforts to fully exploit LECD potential are also discussed.
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References
Uhlmann E, Mullany B, Biermann D, Rajurkar KP, Hausotte T, Brinksmeier E (2016) Process chains for high-precision components with micro-scale features. CIRP Ann 65(2):549–572
Suryavanshi AP, Yu MF (2006) Probe-based electrochemical fabrication of freestanding Cu nanowire array. Appl Phys Lett 88(8):083103–083101
Giannatsis J, Dedoussis V (2007) Additive fabrication technologies applied to medicine and health care: a review. Int J Adv Manuf Tech 40(1–2):116–127
Kamaraj A, Lewis S, Sundaram M (2016) Numerical study of localized electrochemical deposition for micro electrochemical additive manufacturing. Procedia CIRP 42:788–792
Said RA (2004) Localized electro-deposition (LED): the march toward process development. Nanotechnology 15(10):S649–S659
Lin JC, Jang SB, Lee DL, Chen CC, Yeh PC, Chang TK, Yang JH (2005) Fabrication of micrometer Ni columns by continuous and intermittent microanode guided electroplating. J Micromech Microeng 15(12):2405–2413
Brant AM, Sundaram M (2017) A fundamental study of nano electrodeposition using a combined molecular dynamics and quantum mechanical Electron force field approach. Procedia Manuf 10:253–264
Behroozfar A, Daryadel S, Morsali SR, Moreno S, Baniasadi M, Bernal RA, Minary-Jolandan M (2017). Microscale 3D Printing of nanotwinned copper. Adv Mater 30(4):1705107
Daryadel S, Behroozfar A, Morsali SR, Moreno S, Baniasadi M, Bykova J, Bernal RA, Minary-Jolandan M (2018) Localized pulsed electrodeposition process for three-dimensional printing of nanotwinned metallic nanostructures. Nano Lett 18(1):208–214
Morsali R, Qian D, Minary-Jolandan M (2019) Mechanisms of localized pulsed electrodeposition (L-PED) for microscale 3D printing of nanotwinned metals. J Electrochem Soc 166(8):D354–D358
Zhao X, Iyer A, Promoppatum P, Yao SC (2017) Numerical modeling of the thermal behavior and residual stress in the direct metal laser sintering process of titanium alloy products. Addit Manuf 14:126–136
Das S (2003) Physical aspects of process control in selective laser sintering of metals. Adv Eng Mater 5(10):701–711
Vijayaraghavan V, Garg A, Lam JSL, Panda B, Mahapatra SS (2014) Process characterisation of 3D-printed FDM components using improved evolutionary computational approach. Int J Adv Manuf Tech 78(5–8):781–793
Paul BK, Voorakarnam V (2001) Effect of layer thickness and orientation angle on surface roughness in laminated object manufacturing. J Manuf Process 3(2):94–101
Mazumder J, Schifferer A, Choi J (1999) Direct materials deposition-designed macro and microstructure. Mater Res Innov 3(3):118–131
Fowlkes JD, Winkler R, Lewis BB, Stanford MG, Plank H, Rack PD (2016) Simulation-guided 3D nanomanufacturing via focused electron beam induced deposition. ACS Nano 10(6):6163–6172
Skylar-Scott MA, Gunasekaran S, Lewis JA (2016) Laser-assisted direct ink writing of planar and 3D metal architectures. Proc Natl Acad Sci U S A 113(22):6137–6142
Park JU, Hardy M, Kang SJ, Barton K, Adair K, Mukhopadhyay DK, Lee CY, Strano MS, Alleyne AG, Georgiadis JG, Ferreira PM, Rogers JA (2007) High-resolution electrohydrodynamic jet printing. Nat Mater 6(10):782–789
Breckenfeld E, Kim H, Auyeung RC, Pique A (2016) Laser-induced forward transfer of Ag nanopaste. J Vis Exp 109:e53728
Piner RD, Zhu J, Xu F, Hong S, Mirkin CA (1999) “Dip-pen” nanolithography. Science 283(5402):661–663
Meister A, Jeney S, Liley M, Akiyama T, Staufer U, de Rooij NF, Heinzelmann H (2003) Nanoscale dispensing of liquids through cantilevered probes. Microelectron Eng 67-68:644–650
Hartmann-Thompson C, Merrington A, Carver PI, Keeley DL, Rousseau JL, Hucul D, Bruza KJ, Thomas LS, Keinath SE, Nowak RM, Katona DM, Santurri PR (2008) Proton-conducting polyhedral oligosilsesquioxane nanoadditives for sulfonated polyphenylsulfone hydrogen fuel cell proton exchange membranes. J Appl Polym Sci 110(2):958–974
Riddick JC, Haile MA, Wahlde RV, Cole DP, Bamiduro O, Johnson TE (2016) Fractographic analysis of tensile failure of acrylonitrile-butadiene-styrene fabricated by fused deposition modeling. Addit Manuf 11:49–59
Liu Z, Zhan J, Fard M, Davy JL (2016) Acoustic properties of a porous polycarbonate material produced by additive manufacturing. Mater Lett 181:296–299
Zhao J, Swartz LA, Lin WF, Schlenoff PS, Frommer J, Schlenoff JB, Liu GY (2016) Three-dimensional nanoprinting via scanning probe lithography-delivered layer-by-layer deposition. ACS Nano 10(6):5656–5662
Zheng X, Deotte J, Alonso MP, Farquar GR, Weisgraber TH, Gemberling S, Lee H, Fang N, Spadaccini CM (2012) Design and optimization of a light-emitting diode projection micro-stereolithography three-dimensional manufacturing system. Rev Sci Instrum 83(12):125001
Detlef BTW, Wolfram K, Uwe H, Ludwig F (2001) Fabrication of ultrasmall tunnel junctions by electron beam direct-writing. IEEE T Appl Supercon 11(1):373–376
Satoshi K, Sun HB, Tomokazu T, Kenji T (2001) Finer features for functional microdevices. Nature 412(6848):697–698
John DM, Ian WH (1996) Three-Dimensional icrofabrication by localized electrochemical deposition. J Microelectromech S 5(1):24–32
El-Giar EM, Said RA, Bridges GE, Thomson DJ (2000) Localized Electrochemical Deposition of Copper Microstructures. J Electrochem Soc 147(2):586–591
Anders J, G T, Stefan J (2000) High Resolution 3D Microstructures Made by LocalizedElectrodeposition of Nickel. J Electrochem Soc 147(5):1810–1817
Choo SH, Ya JH (2001) Effects of rotor electrode in the fabrication of high aspect ratiomicrostructures by localized electrochemical deposition. J Micromech Microeng 11:435–442
Yeo SH, J HC, a. K HAS (2002) On the effects of ultrasonic vibrations on localized electrochemical deposition. J Micromech Microeng 12:271–279
Yong L, Yunfei Z, Guang Y, Liangqiang P (2003) Localized electrochemical micromachining with gap control. Sensor Actuat A-Phys 108(1-3):144–148
Said RA (2003) Microfabrication by localized electrochemical deposition experimentalinvestigation and theoretical modelling. Nanotechnology 14:523–531
Said RA (2004) Adaptive Tip-Withdrawal Control for Reliable Microfabrication by Localized Electrodeposition. J Microelectromech S 13(5):822–832
Choo JH, Yeo SH, Tan FF (2004) Flexible tooling for localized electrochemical deposition with wire-electrodischarge grinding. Microsyst Technol 10(2):127–136
Chang TK, Lin JC, Yang JH, Yeh PC, Lee DL, Jiang SB (2007) Surface and transverse morphology of micrometer nickel columns fabricated by localized electrochemical deposition. J Micromech Microeng 17(11):2336–2343
Lin JC, Yang JH, Chang TK, Jiang SB (2009) On the structure of micrometer copper features fabricated by intermittent micro-anode guided electroplating. Electrochim Acta 54(24):5703–5708
Sundaram MM, Kamaraj AB, Kumar VS (2014) Mask-Less Electrochemical Additive Manufacturing: A Feasibility Study. J Manuf Sci E-T. Asme 137(2)021006
Hu J, Yu MF (2010) Meniscus-confined three-dimensional electrodeposition for direct writing of wire bonds. Science 329(5989):313–316
Aydemir N, Parcell J, Laslau C, Nieuwoudt M, Williams DE, Travas-Sejdic J (2013) Direct writing of conducting polymers. Macromol Rapid Commun 34(16):1296–1300
Seol SK, Kim D, Lee S, Kim JH, Chang WS, Kim JT (2015) Electrodeposition-based 3D Printing of Metallic Microarchitectures with Controlled Internal Structures. Small 11(32):3896–3902
Yi Z, Guo J, Chen Y, Zhang H, Zhang S, Xu G, Yu M, Cui P (2016) Vertical, capacitive microelectromechanical switches produced via direct writing of copper wires. Microsyst Nanoeng 2:16010. https://doi.org/10.1038/micronano.2016.10
Chen X, Liu X, Childs P, Brandon N, Wu B (2017) A Low Cost Desktop Electrochemical Metal 3D Printer. Adv Mater Technol-US 2(10)
Shim DS (2012) Development of the printing method for electrically conductive material using AFM probe integrated with microelectrode. UNIST
Hirt L, Ihle S, Pan Z (2016) Dorwling-Carter, L, Reiser, A, Wheeler, J. M, Spolenak, R, Voros, J, Zambelli, T., Template-Free 3D Microprinting of Metals Using a Force-Controlled Nanopipette for Layer-by-Layer Electrodeposition. Adv Mater 28(12):2311–2315
Marco R, D O, Scott AB, Alex Z, Jean MJ, Fréchet (2007) Fabrication of magnetic force microscopy probes via localized electrochemical deposition of cobalt. J Vac Sci Technol B 25(5):39–42
Sundaram M, Kamaraj AB, Lillie G (2018) Experimental Study of Localized Electrochemical Deposition of Ni-Cu Alloy Using a Moving Anode. Procedia CIRP 68:227–231
Kamaraj AB, Sundaram M (2019) A mathematical model of the deposition rate and layer height during electrochemical additive manufacturing. Int J Adv Manuf Tech 102(5-8):2367–2374
Sundaram M, Drexelius A, Kamaraj AB (2018) A study on the effect of interelectrode gap in the electrochemical additive manufacturing process. Mach Sci Technol 23(2):232–248
Seol SK, Kim JT, Je JH, Hwu Y, Margaritondo G (2007) Fabrication of Freestanding Metallic Micro Hollow Tubes by Template-Free Localized Electrochemical Deposition. Electrochem Solid-State Lett 10(5):C44–C46
Morsali S, Daryadel S, Zhou Z, Behroozfar A, Qian D, Minary-Jolandan M (2017) Multi-physics simulation of metal printing at micro/nanoscale using meniscus-confined electrodeposition: Effect of environmental humidity. J Appl Phys 121(2). https://doi.org/10.1063/1.4973622
Morsali S, Daryadel S, Zhou Z, Behroozfar A, Baniasadi M, Moreno S, Qian D, Minary-Jolandan M (2017) Multi-physics simulation of metal printing at micro/nanoscale using meniscus-confined electrodeposition: Effect of nozzle speed and diameter. J Appl Phys 121(21)
Kamaraj AB, Sundaram M (2018) A study on the effect of inter-electrode gap and pulse voltage on current density in electrochemical additive manufacturing. J Appl Electrochem 48(4):463–469
Rajput MS, Pandey PM, Jha S (2015) Modelling of high speed selective jet electrodeposition process. J Manuf Process 17:98–107
Volgin VM, Kabanova TB, Davydov AD (2018) Modeling of local maskless electrochemical deposition of metal microcolumns. Chem Eng Sci 183:123–135
Ian WH, O L, Serge RL, John DM (1997) Three dimensional microfabrication by localized electrodeposition and etching. patent
Wang F, Xiao H, He H (2016) Effects of applied potential and the initial gap between electrodes on localized electrochemical deposition of micrometer copper columns. Sci Rep 6:26270
Wang F, Bian H, Xiao Y (2019) Fabrication of Micro-Sized Copper Columns Using Localiz Electrochemical Deposition with a 20μm Diameter Micro Anode. ECS J Solid State Sc 8(4):Ped 223–PedP227
Lin JC, Chang TK, Yang JH, Chen YS, Chuang CL (2010) Localized electrochemical deposition of micrometer copper columns by pulse plating. Electrochim Acta 55(6):1888–1894
Yang JH, Lin JC, Chang TK, Lai GY, Jiang SB (2008) Assessing the degree of localization in localized electrochemical deposition of copper. J Micromech Microeng 18(5)
Brant AM, Sundaram MM, Kamaraj AB (2014) Finite Element Simulation of Localized Electrochemical Deposition for Maskless Electrochemical Additive Manufacturing. J Manuf Sci Eng 137(1)
Thornell G, Jansson A, Johansson SAI (1999) Direct writing of nickel by electrodeposition from various electrolytes. Part of the Conference on Device and Process Technoloçjies for MEMS and Microelectronics 3892:166–175
Seol SK, Pyun AR, Hwu Y (2005) Margaritondo, G, Je, J. H., Localized Electrochemical Deposition of Copper Monitored Using Real-Time X-ray Microradiography. Adv Funct Mater 15(6):934–937
Volgin VM, Lyubimov VV, Gnidina IV, Davydov AD, Kabanova TB (2018) Simulation of Localized Electrodeposition of Microwires and Microtubes. Procedia CIRP 68:242–247
Yeo SH, J HC KSY (2000) Localized Electrochemical Deposition —The Growth Behavior of Nickel Micro-Columns. Proc SPIE 4174:30–39
Brant A, Sundaram M (2016) A Novel Electrochemical Micro Additive Manufacturing Method of Overhanging Metal Parts without Reliance on Support Structures. Procedia Manufacturing 5:928–943
Nelson JB, Wisecarver Z, Schwartz DT (2007) Electrochemical printing: mass transfer effects. J Micromech Microeng 17(6):1192–1199
Lin JC, Chang TK, Yang JH, Jeng JH, Lee DL, Jiang SB (2009) Fabrication of a micrometer Ni–Cu alloy column coupled with a Cu micro-column for thermal measurement. J Micromech Microeng 19(1)
Wang FF, Wang W, He X, Han L, Zhou JZ, Tian ZQ, Tian ZW, Zhan D (2017) Nanofabrication of the gold scanning probe for the STM-SECM coupling system with nanoscale spatial resolution. Sci China Chem 60(5):649–655
El-Giar EM, Thomson DJ (1997) Localized electrochemical plating of interconnectors for microelectronics, IEEE WESCANEX 97 Communications, Power and Computing. Conference Proceedings, Winnipeg, Manitoba, pp 327–332
Pané S, Panagiotopoulou V, Fusco S, Pellicer E, Sort J, Mochnacki D, Sivaraman KM, Kratochvil BE, Baró MD, Nelson BJ (2011) The effect of saccharine on the localized electrochemical deposition of Cu-rich Cu–Ni microcolumns. Electrochem Commun 13(9):973–976
Yang JH, Lin JC, Chang TK, You XB, Jiang SB (2009) Localized Ni deposition improved by saccharin sodium in the intermittent MAGE process. J Micromech Microeng 19(2)
Zhang Z, Jiang Y, Huang L, Nie X, Liu G (2015) Experiment study of laser thermal enhanced electrochemical deposition. Microsyst Technol 23(6):1695–1701
Cho CH, Shin HS, Chu CN (2013) Selective electrodeposition of copper on stainless steel using laser irradiation. Surf Coat Technol 222:15–24
Du L (2016) Improvement of microfulidic chip mould thickness uniformity by ultrasonic agitation during electroforming process. Int J Adv Manuf Technol 28(6) 064111-1-5
Kang H, Hwang S, Kwak J (2015) A hydrogel pen for electrochemical reaction and its applications for 3D printing. Nanoscale 7(3):994–1001
Rajput MS, Pandey PM, Jha S (2013) Micromanufacturing by selective jet electrodeposition process. Int J Adv Manuf Technol 76(1-4):61–67
Hong KC, J UP, O OP, Placid MF, John GG, John AR (2008) Scaling laws for jet pulsations associated with high-resolution electrohydrodynamic printing. Appl Phys Lett 92(92) 123109-1-3
Huang D, Shen L, Chen J, Zhu J (2013) The Influence of Cathode Surface Velocity on Friction Aided Jet Electrodeposition. T Indian I Metals 67(3):351–357
Chouchane S, Levesque A, Zabinski P, Rehamnia R, Chopart JP (2010) Electrochemical corrosion behavior in NaCl medium of zinc–nickel alloys electrodeposited under applied magnetic field. J Alloys Compd 506(2):575–580
Tseng YT, Lin JC, Ciou YJ, Hwang YR (2014) Fabrication of a novel microsensor consisting of electrodeposited ZnO nanorod-coated crossed Cu micropillars and the effects of nanorod coating morphology on the gas sensing. ACS Appl Mater Interfaces 6(14):11424–11438
Hu J (2011) Interfacial Physics In Meniscus-Confined Electrodeposition And Its Applications For Fabricating Electronic Structures. University of Illinois at Urbana-Champaign
Park J, Kim KI, Kim K, Kim DC, Cho D, Lee JH, Jeon S (2015) Rapid, High-Resolution 3D Interference Printing of Multilevel Ultralong Nanochannel Arrays for High-Throughput Nanofluidic Transport. Adv Mater 27(48):8000–8006
McKelvey K, O'Connell MA, Unwin PR (2013) Meniscus confined fabrication of multidimensional conducting polymer nanostructures with scanning electrochemical cell microscopy (SECCM). Chem Commun (Camb) 49(29):2986–2988
Schon P, Geerlings J, Tas N, Sarajlic E (2013) AFM cantilever with in situ renewable mercury microelectrode. Anal Chem 85(19):8937–8942
Mojun C, Z X, Jung HK, Seung KS, Ji TK (2018) Meniscus-on-Demand Parallel 3D Nanoprinting. ACS Nano 12(5):6
Lin YP, Z Y, Yu MF (2018) Parallel Process 3D Metal Microprinting. Adv Mater Technol 1800393, 7
Dermutz H, Gruter RR, Truong AM, Demko LV, ZT J (2014) Local polymer replacement for neuron patterning and in situ neurite guidance. Langmuir 30(23):7037–7046
Mathias JA, H D, Jose FSC, Hana H, László D, Tomaso Z, János V (2015) Local Chemical Stimulation Of Neurons Using Fluidfm Technology Combined With Microelectrode Arrays. 19th International Conference on Miniaturized Systems for Chemistry and. Life Sci:653–655
Meister A, Gabi M, Behr P, Studer P, Voros J, Niedermann P, Bitterli J, Polesel-Maris J, Liley M, Heinzelmann H, Zambelli T (2009) FluidFM: combining atomic force microscopy and nanofluidics in a universal liquid delivery system for single cell applications and beyond. Nano Lett 9(6):2501–2507
Francisco VDSJ, Liu Y, Wang S, Dorig P, Tonya LK, Frommer J, Liu G (2018) Three-dimensional nanoprinting via direct delivery. J Phys Chem B acs.jpcb.7b06978
Ercolano G, Zambelli T, van N C, M D, V J, M T, Koelmans WW (2019) Multiscale Additive Manufacturing of Metal Microstructures. Adv Eng Mater. https://doi.org/10.1002/adem.201900961
Ercolano G, van N C, Merle T, Voros J, Momotenko D, Koelmans WW, Zambelli T (2019) Additive Manufacturing of Sub-Micron to Sub-mm Metal Structures with Hollow AFM Cantilevers. Micromachines 11(1):6
Whitaker JD, Nelson JB, Schwartz DT (2005) Electrochemical printing: software reconfigurable electrochemical microfabrication. J Micromech Microeng 15(8):1498–1503
Reiser AL, M R, P M, A G, H S, A S, Wheeler JM, Zenobi RP, SR D (2019) Multi-metal electrohydrodynamic redox 3D printing at the submicron scale. Nat Commun 10(1):1853
Lee AY, An JC, K C (2017) Two-Way 4D Printing: A Review on the Reversibility of 3D-Printed Shape Memory Materials. Engineering-PRC 3(5):663–674
Acknowledgments
This review includes numerous science research literature in electrochemical deposition and additive manufacturing filed. Here, we must express our heartfelt thanks to all the researchers.
Funding
This work was supported by National Key Research and Development Program (No. 2018YFB1107403); The Fund for Equipment Pre-Research (No. 61409230312); China-EU H2020 International Science and Technology Cooperation Programme (FabSurfWAR Nos. 2016YFE0112100 and 644971); Jilin Province Science and Technology Development Program (Nos. 20180201057GX and Z20190101005JH); and the “111” Project of China (No. D17017).
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Xu, J., Ren, W., Lian, Z. et al. A review: development of the maskless localized electrochemical deposition technology. Int J Adv Manuf Technol 110, 1731–1757 (2020). https://doi.org/10.1007/s00170-020-05799-5
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DOI: https://doi.org/10.1007/s00170-020-05799-5