Skip to main content
Log in

A simple method for predicting the machinability in microwave cutting ceramics with microwave-induced thermal-crack propagation

  • ORIGINAL ARTICLE
  • Published:
The International Journal of Advanced Manufacturing Technology Aims and scope Submit manuscript

Abstract

Microwave-induced thermal-crack propagation (MITP) is an advanced processing technology for cutting ceramics introduced recently. However, due to the lack of methods to predict its machinability, its application has been limited. In order to evaluate the machinability of this method for different ceramic materials, in this paper, a simple method is presented to predict the machinability in microwave cutting ceramics. Firstly, the processing difficulty of microwave cutting ceramics using MITP is analyzed based on the fracture mechanics, and the concept of crack initiation factor is proposed. An experimental work demonstrates that crack initiation factor is effective to predict the machinability. However, the crack initiation factor is closely related to many process parameters in MITP, so its prediction process is complicated. To find a practical and straightforward method, the ceramic heated by the static point heat source is analyzed, and the crack initiation factor is simplified as the crack factor which is only related to the physical parameters of the material in this model. The theoretical calculation shows that there is a positive correlation between the crack factor and the crack initiation factor, so the machinability in MITP can be predicted by this simplified factor. By establishing a link with the processing parameters, the crack factor can be used to pre-select the processing parameters. The simulation results show that the crack factor can also be used to predict the relative magnitude of temperature gradient and maximum thermal stress of different ceramics under the same processing conditions. This study provides a simple and effective method for predicting the machinability of ceramics using MITP.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12
Fig. 13

Similar content being viewed by others

References

  1. Chen B, Guo B, Zhao Q (2015) An investigation into parallel and cross grinding of aspheric surface on monocrystal silicon. Int J Adv Manuf Technol 80(5-8):737–746

    Article  Google Scholar 

  2. Li C, Zhang F, Meng B, Liu L, Rao X (2017) Material removal mechanism and grinding force modelling of ultrasonic vibration assisted grinding for SiC ceramics. Ceram Int 43(3):2981–2993

    Article  Google Scholar 

  3. Muhammad A, Rahman M, San WY, Doshi N (2011) An experimental approach to study the capability of end-milling for microcutting of glass. Int J Adv Manuf Technol 53(9-12):1063–1073

    Article  Google Scholar 

  4. Li C, Zhang F, Wu Y, Zhang X (2018) Influence of strain rate effect on material removal and deformation mechanism based on ductile nanoscratch tests of Lu2O3 single crystal. Ceram Int 44(17):21486–21498

    Article  Google Scholar 

  5. Ding Y, Yang L, Cheng B, Wang X, Wang Y, Xie H (2018) Investigations on femtosecond laser-modified microgroove-textured cemented carbide YT15 turning tool with promotion in cutting performance. Int J Adv Manuf Technol 96:4367–4379

    Article  Google Scholar 

  6. Hu H, Zhai Z, Li Y, Wang H, Dai J (2015) Researches on physical field evolution of micro-cutting of steel h13 by micron scale ceramic cutter based on finite element modeling. Int J Adv Manuf Technol 78(9-12):1407–1414

    Article  Google Scholar 

  7. Anicic O, Jović S, Skrijelj H, Nedić B (2017) Prediction of laser cutting heat affected zone by extreme learning machine. Opt Lasers Eng 88:1–4

    Article  Google Scholar 

  8. Yang L, Ding Y, Cheng B, Mohammed A, Wang Y (2017) Numerical simulation and experimental research on reduction of taper and HAZ during laser drilling using moving focal point. Int J Adv Manuf Technol 91(1-4):1171–1180

    Article  Google Scholar 

  9. Quintero F, Pou J, Lusquiños F, Riveiro A, Pérez-Amor M (2007) Single-pass and multi-pass laser cutting of Si–SiC: assessment of the cut quality and microstructure in the heat affected zone. J Laser APPL 19(3):170–176

    Article  Google Scholar 

  10. Li H, Wang Y, Wang Z, Zhao Z (2018) Fabrication of ZrB2–SiC–graphite ceramic micro-nozzle by micro-EDM segmented milling. J Micromech Microeng 28(10):105022

    Article  Google Scholar 

  11. Hu C, Zhou Y, Bao Y (2008) Material removal and surface damage in EDM of TiSiC ceramic. Ceram Int 34(3):537–541

    Article  Google Scholar 

  12. Evans A (2010) Perspective on the development of high-toughness ceramics. J Am Ceram Soc 73(2):187–206

    Article  Google Scholar 

  13. Ma L, Wang H, Yu A, Wang L, Zhou Y (2017) Theoretical equation of cutting temperature for brittle materials in turning fluorophlogopite ceramics. Int J Adv Manuf Technol 92:3571–3582

    Article  Google Scholar 

  14. Lumley R (1969) Controlled separation of brittle materials using a laser. Am Ceram Soc Bull 48(9):850–854

    Google Scholar 

  15. Haupt O, Schuetz V (2009) Schoonderbeek A, et al. High quality laser cleaving process for mono-and polycrystalline silicon. Proc Of Spie 72020G-72020G-11.

  16. Saman A, Furumoto T, Ueda T, Hosokawa A (2015) A study on separating of a silicon wafer with moving laser beam by using thermal stress cleaving technique. J Mater Process Technol 223:252–261

    Article  Google Scholar 

  17. Yamada K, Ueda T, Hosokawa A, Yamane Y, Sekiya K (2006) Thermal damage of silicon wafer in thermal cleaving process with pulsed laser and CW laser. Proc Of Spie 6107:61070H–61070H-10

    Article  Google Scholar 

  18. Shalupaev S, Serdyukov A, Mityurich G, Aleksiejuk M, Nikitjuk Y, Sereda A (2013) Modeling of mechanical influence of double-beam laser on single-crystalline silicon. Arch Metall Mater 58(4):1381–1385

    Article  Google Scholar 

  19. Cai Y, Yang L, Zhang H, Wang Y (2016) Laser cutting silicon-glass double layer wafer with laser induced thermal-crack propagation. Opt Lasers Eng 82:173–185

    Article  Google Scholar 

  20. Cai Y, Wang M, Zhang H, Yang L, Fu X, Wang Y (2017) Laser cutting sandwich structure glass–silicon–glass wafer with laser induced thermal–crack propagation. Opt Laser Technol 93:49–59

    Article  Google Scholar 

  21. Cheng X, Yang L, Wang M, Cai Y, Wang Y, Ren Z (2019) Laser beam induced thermal-crack propagation for asymmetric liner cutting of silicon wafer. Opt Laser Technol 120:105765

    Article  Google Scholar 

  22. Zhao C, Zhang H, Yang L, Wang Y, Ding Y (2016) Dual laser beam revising the separation path technology of laser induced thermal-crack propagation for asymmetric linear cutting glass. Int J Mach Tool Manu 106:43–55

    Article  Google Scholar 

  23. Yang L, Wang Y, Tian Z, Cai N (2010) YAG laser cutting soda-lime glass with controlled fracture and volumetric heat absorption. Int J Mach Tool Manu 50(10):849–859

    Article  Google Scholar 

  24. Zhao C, Zhang H, Wang Y (2014) Semiconductor laser asymmetry cutting glass with laser induced thermal-crack propagation. Opt Lasers Eng 63:43–52

    Article  Google Scholar 

  25. Cheng X, Yang L, Wang M, Cai Y, Wang Y, Ren Z (2019) The unbiased propagation mechanism in laser cutting silicon wafer with laser induced thermal-crack propagation. Appl Phys A Mater Sci Process 125(7):479

    Article  Google Scholar 

  26. Haupt O, Siegel F, Schoonderbeek A, Richter L, Ostendorf A (2008) Laser dicing of silicon: comparison of ablation mechanisms with a novel technology of thermally induced stress. J Laser Micro Nanoen 3(3):135–140

    Article  Google Scholar 

  27. Karube K, and Karube N (2008) Laser-induced cleavage of LCD glass as full-body cutting. Laser-based Micro-& Nanopackaging & Assembly II 6880: 688007

  28. Wang H, Zhang H, Wang Y (2016) Cutting of glass and SiC ceramic sheets using controlled fracture technique with elliptic microwave spot. Ceram Int 43(2):1669–1676

    Article  Google Scholar 

  29. Tsai C, Chen H (2003) Laser cutting of thick ceramic substrates by controlled fracture technique. J Mater Process Technol 136(1-3):166–173

    Article  Google Scholar 

  30. Wang H, Zhang H, Wang Y, Wang M (2019) Thermal controlled fracture of Al2O3 substrate by inducing microwave discharge in graphite coat. Ceram Int 45(5):6149–6159

    Article  Google Scholar 

  31. Lawn B (1993) Fracture of brittle solids, 2nd edn. Cambridge University Press, Cambridge University Press

    Book  Google Scholar 

  32. Sutton W (1989) Microwave processing of ceramic materials. Ceramic Bulletin 68:376–385

    Google Scholar 

  33. Stern M, Becker E, Dunham R (1976) A contour integral computation of mixed-mode stress intensity factors. Int J Fract 12(3):359–368

    Google Scholar 

Download references

Funding

This research is supported by the National Science Foundation of China (Grant No. 51275118).

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Xiaoliang Cheng.

Additional information

Publisher’s note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Zhao, C., Cheng, X., Wang, H. et al. A simple method for predicting the machinability in microwave cutting ceramics with microwave-induced thermal-crack propagation. Int J Adv Manuf Technol 109, 2639–2651 (2020). https://doi.org/10.1007/s00170-020-05731-x

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s00170-020-05731-x

Keywords

Navigation