Abstract
A novel hybrid polishing process, called laser-assisted polishing (LAP), was proposed in this study for improving the material removal rate (MRR) of polishing silicon carbide (SiC) by combining a CO2 laser source and a conventional polishing machine. The results showed that the MRR increased by 79.0% using the LAP process on the cracked and oxidized SiC sample surface as compared to that using the mechanical polishing of a normal sample. It was also found that the laser-induced crack was the main mechanism underlying the growth of MRR in the LAP process. It was expected that the proposed LAP process and the material removal mechanism might shed light on the expansion of the hybrid machining field and better industrial application of SiC.
Similar content being viewed by others
Abbreviations
- LAP:
-
Laser-assisted polishing
- MRR:
-
Material removal rate
- SiC:
-
Silicon carbide
- RB SiC:
-
Reaction bonded SiC (manufacturing method)
- S SiC:
-
Sintered SiC (manufacturing method)
- NSF:
-
Not specified
- LAM:
-
Laser-assisted machining
- UV:
-
Ultraviolet
- CMP:
-
Chemical-mechanical or chemo-mechanical polishing
- PDMS:
-
Polydimethylsiloxane
- LBM:
-
Laser beam machining
- P:
-
Mechanical polishing
- N sample:
-
Sample with no crack or oxidation (as-received)
- CO sample:
-
Sample with crack and oxidation
- C sample:
-
Sample with crack (oxidation inhibited)
- RPM:
-
Rotation per minute
- XRD:
-
X-ray diffractometer
- XPS:
-
X-ray photoemission spectroscopy
- R a :
-
Average roughness of surface measured from 1D line profile
- R pv :
-
Peak-to-valley roughness of surface measured from 1D line profile
- S a :
-
Average roughness of surface measured from 2D area
- CCI:
-
Coherent correlation interferometry
References
Lawn BR, Padture NP, Cait H, Guiberteau F (1994) Making ceramics “ductile”. Science 263(5150):1114–1116
Casstevens JM et al (2001) Silicon carbide high performance optics: a cost-effective, flexible fabrication process. In: International Symposium on Optical Science and Technology. International Society for Optics and Photonics
Robichaud J et al (2005) Recent advances in reaction bonded silicon carbide optics and optical systems. In: Optics & Photonics 2005. International Society for Optics and Photonics
Beaucamp A et al (2017) Brittle-ductile transition in shape adaptive grinding (SAG) of SiC aspheric optics. Int J Mach Tools Manuf 115:29–37
Yan G, You K, Fang F (2019) Three-Linear-Axis Grinding of Small Aperture Aspheric Surfaces. Int J Precis Eng Manuf Green Technol:1–12
Rayleigh L (1917) Polish. Trans Opt Soc 19(1):38
Preston F (1927) The theory and design of plate glass polishing machines. J Soc Glass Technol 11:214
Tam HY, Cheng H, Wang Y (2007) Removal rate and surface roughness in the lapping and polishing of RB-SiC optical components. J Mater Process Technol 192:276–280
Cheng H et al (2008) Mechanisms for grinding and polishing of silicon carbide with loose abrasive sub-aperture tools. Adv Manuf Technol XXII:65
Klocke F, Zunke R (2009) Removal mechanisms in polishing of silicon based advanced ceramics. CIRP Ann Manuf Technol 58(1):491–494
Tsai M et al (2015) Investigation of increased removal rate during polishing of single-crystal silicon carbide. Int J Adv Manuf Technol 80(9–12):1511–1520
Ho J-K et al (2016) Investigation of polishing pads impregnated with Fe and Al2O3 particles for single-crystal silicon carbide wafers. Appl Sci 6(3):89
Liu G et al (2010) Removal behaviors of different SiC ceramics during polishing. J Mater Sci Technol 26(2):125–130
Kubota A et al (2015) Abrasive-free polishing of single-crystal 4H-SiC with silica glass plates. ECS J Solid State Sci Technol 4(12):P468–P475
Li ZL et al (2015) A study of computer controlled ultra-precision polishing of silicon carbide reflecting lenses for enhancing surface roughness. In: Key Engineering Materials. Trans Tech Publ
Gu Y et al (2017) Investigation of silicon carbide ceramic polishing by simulation and experiment. Adv Mech Eng 9(11):1687814017729090
Lauwers B et al (2014) Hybrid processes in manufacturing. CIRP Ann Manuf Technol 63(2):561–583
Kozak J, Rajurkar KP (2000) Hybrid machining process evaluation and development. In: Proceedings of 2nd international conference on machining and measurements of sculptured surfaces, Keynote Paper, Krakow
Sun S, Brandt M, Dargusch M (2010) Thermally enhanced machining of hard-to-machine materials—a review. Int J Mach Tools Manuf 50(8):663–680
Brecher C et al (2011) Laser-assisted milling of advanced materials. Phys Procedia 12:599–606
Kim D-H, Lee C-M (2014) A study of cutting force and preheating-temperature prediction for laser-assisted milling of Inconel 718 and AISI 1045 steel. Int J Heat Mass Transf 71:264–274
Kobayashi N et al (2008) Precision treatment of silicon wafer edge utilizing ultrasonically assisted polishing technique. J Mater Process Technol 201(1–3):531–535
Shiou F-J, Ciou H-S (2008) Ultra-precision surface finish of the hardened stainless mold steel using vibration-assisted ball polishing process. Int J Mach Tools Manuf 48(7–8):721–732
Suzuki H et al (2010) Ultraprecision finishing of micro-aspheric surface by ultrasonic two-axis vibration assisted polishing. CIRP Ann Manuf Technol 59(1):347–350
Lin WM et al (2013) Polishing Characteristics of a Low Frequency Vibration Assisted Polishing Method. In: Advanced Materials Research. Trans Tech Publ
Cheng H et al (2005) Magnetorheological finishing of SiC aspheric mirrors. Mater Manuf Process 20(6):917–931
Yamaguchi H et al (2009) Study of finishing of wafers by magnetic field-assisted finishing. J Adv Mech Des Syst Manuf 3(1):35–46
Yamamura K et al (2011) Plasma assisted polishing of single crystal SiC for obtaining atomically flat strain-free surface. CIRP Ann Manuf Technol 60(1):571–574
Takahashi N et al (2017) Study on laser assisted polishing of SiC. Proc JSPE Semest Meet 2017S:519–520
Yang X et al (2017) Effects of artificial defect on the material residual strength of SiC ceramics after thermal-shock. Mater Sci Eng A 707:159–163
Shukla P et al (2017) Surface property modifications of silicon carbide ceramic following laser shock peening. J Eur Ceram Soc 37(9):3027–3038
Wang C et al (2017) The Polishing Effect of SiC Substrates in Femtosecond Laser Irradiation Assisted Chemical Mechanical Polishing (CMP). ECS J Solid State Sci Technol 6(4):P105–P112
Zhang X et al (2018) Study on the grinding behavior of laser-structured grinding in silicon nitride ceramic. Int J Adv Manuf Technol:1–11
Dahotre NB, Harimkar S (2008) Laser fabrication and machining of materials. Springer Science & Business Media
Stournaras A et al (2009) An investigation of quality in CO2 laser cutting of aluminum. CIRP J Manuf Sci Technol 2(1):61–69
Chryssolouris G, Stavropoulos P, Salonitis K (2013) Process of laser machining, Handbook of manufacturing engineering and technology, pp 1–25
Stavropoulos P, Chryssolouris G (2007) Molecular dynamics simulations of laser ablation: the Morse potential function approach. Int J Nanomanuf 1(6):736–750
Stavropoulos P et al (2010) Experimental and theoretical investigation of the ablation mechanisms during femptosecond laser machining. Int J Nanomanuf 6(1–4):55–65
Agarwal S, Rao PV (2008) Experimental investigation of surface/subsurface damage formation and material removal mechanisms in SiC grinding. Int J Mach Tools Manuf 48(6):698–710
Suratwala T et al (2006) Sub-surface mechanical damage distributions during grinding of fused silica. J Non-Cryst Solids 352(52–54):5601–5617
Bragg WH, Bragg WL (1913) The reflection of X-rays by crystals. Proc R Soc Lond A 88(605):428–438
Islam M, Campbell G (1993) Laser machining of ceramics: a review. Mater Manuf Process 8(6):611–630
Uchimura H, Kokaji A, Kaji M (1992) Evaluation of fast fracture strength of ceramic components under multiaxial stress states. In: ASME 1992 International Gas Turbine and Aeroengine Congress and Exposition. American Society of Mechanical Engineers.
Funding
This research was supported by the Korea Basic Science Institute (KBSI) Creative Convergence Research Project (CAP-PN2018007) funded by the National Research Council of Science and Technology (NST), and also supported by the Basic Research Lab Program through the National Research Foundation of Korea (NRF) funded by the MSIT (2018R1A4A1059976).
Author information
Authors and Affiliations
Corresponding author
Additional information
Publisher’s note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
About this article
Cite this article
Kim, M., Bang, S., Kim, DH. et al. Hybrid CO2 laser-polishing process for improving material removal of silicon carbide. Int J Adv Manuf Technol 106, 3139–3151 (2020). https://doi.org/10.1007/s00170-019-04846-0
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s00170-019-04846-0