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Electromechanical impedance (EMI) measurements to infer features from the grinding process

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Abstract

This paper discusses the correlations between the electromechanical impedance (EMI) technique and grinding parameters. The EMI technique applied in grinding is novel and has the advantage of employing cheaper equipment and requiring a simpler monitoring system when compared to traditional techniques, such as acoustic emission. Experimental tests were conducted in a controlled environment to isolate the variables of interest, and real and imaginary parts of the impedance were investigated for several frequency bands. Strong correlations among EMI and equivalent chip thickness, roughness, and microhardness of the workpiece, as well as power signals, were found. The RMSD (root-mean-square deviation) index for the real part of the signature in the band 80–85 kHz showed good correlation with roughness and power, while the CCDM (correlation coefficient deviation metric) index for the imaginary part of 50–55 kHz showed good correlation with microhardness. Those correlations allow the user to infer information about the grinding process through indirect monitoring.

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Abbreviations

(ae):

Depth of cut, μm

CCDM:

Correlation coefficient deviation metric

h eq :

Equivalent chip thickness, μm

Q’ w :

Specific material removal rate, mm3/mm.s

ρ :

Pearson correlation coefficient

R a :

Arithmetic average roughness, μm

RMSD :

Root-mean-square deviation

vs :

Cutting speed, m/s

v w :

Workpiece speed, m/min

Z 1 :

Impedance of the health structure, Ohm

Z 2 :

Impedance of the damaged structure, Ohm

Z E :

Electrical impedance, Ohm

Z S :

Mechanical impedance of the structure, Ohm

Z T :

Impedance of the piezoelectric, Ohm

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Acknowledgments

The authors would like to thank the Department of Electrical Engineering of Faculty of Engineering, Sao Paulo State University (UNESP), Bauru, SP, Brazil; School of Mechanical Engineering, Federal University of Uberlândia, Uberlândia, Brazil; and School of Integrated Studies, Kansas State University, Salina, KS, USA, for enabling the development of the part of that research that resulted in this work.

Funding

This work was supported in part by the CAPES Foundation, Ministry of Education of Brazil, financially (grant PDSE 88881.190384/2018-01). Rosemar B. da Silva thanks the CAPES for the concession of the PNDP postdoctoral scholarship at the Post-Graduate Program of Electrical Engineering of FEB-UNESP-BAURU (2016–2017), as well as CNPq, for its financial support through the universal demand, process no. 426018/2018-4.

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Authors and Affiliations

  1. Department of Electrical Engineering, Sao Paulo State University (UNESP), Av. Eng. Luís Edmundo Carrijo Coube, 14-01 – CEP, Bauru, SP, 17033-360, Brazil

    Fabio Isaac Ferreira, Paulo Roberto de Aguiar & Fabrício Guimarães Baptista

  2. School of Mechanical Engineering, Federal University of Uberlândia (UFU), Av. João Naves de Ávila, 2121, Uberlândia, MG, Brazil

    Rosemar Batista da Silva & Rodrigo de Souza Ruzzi

  3. School of Integrated Studies, Kansas State University Polytechnic Campus, 2310 Centennial Rd, Salina, KS, USA

    Mark James Jackson

  4. Department of Mechanical Engineering, Sao Paulo State University (UNESP), Av. Eng. Luís Edmundo Carrijo Coube, 14-01, Bauru, SP, Brazil

    Eduardo Carlos Bianchi

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  1. Fabio Isaac Ferreira
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Ferreira, F.I., de Aguiar, P.R., da Silva, R.B. et al. Electromechanical impedance (EMI) measurements to infer features from the grinding process. Int J Adv Manuf Technol 106, 2035–2048 (2020). https://doi.org/10.1007/s00170-019-04733-8

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