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Magnetic-aided electrospark deposition

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Abstract

A new electrospark deposition method (ESD), which employs a magnetized electrode to which fine powder is attracted, is proposed and studied. Unlike the traditional ESD method which employs a solid bar electrode, the electrode tip of this latest development can be regarded as a “fluidized” head formed by an assembly of coating powders. With the powder-assembled head acting like a soft brush, the electrode can closely follow the surface contours of the workpiece. For this magnetic-aided electrospark deposition method (M-ESD), the spark discharge location and the contact condition are no longer dictated by the irregular surface asperities of the solid electrode, but instead, “soft” contacts, which are self-regulating, are established between the magnetized coating powders and the workpiece surface. The experimental results showed that M-ESD was a more stable process than the traditional ESD process; moreover, the deposition weight of the former was significantly higher than that of the latter. The discharge mechanisms of these two processes were found to be different: single discharge for ESD and multiple discharges for M-ESD. This was confirmed by the discharge images captured by a high-speed camera and was supported by the results of the simulation of the electrical fields of the electrodes in the traditional ESD and M-ESD processes.

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Funding

The work described in this paper was fully supported by a grant from the Research Grants Council of the Hong Kong Special Administrative Region, China (Project No. PolyU 152096/15E).

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Authors and Affiliations

  1. The Advanced Manufacturing Technology Research Centre, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hung Hom, Hong Kong

    T. M. Yue & J. W Liu

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  1. T. M. Yue
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  2. J. W Liu
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Correspondence to T. M. Yue.

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Yue, T.M., Liu, J.W. Magnetic-aided electrospark deposition. Int J Adv Manuf Technol 105, 1507–1517 (2019). https://doi.org/10.1007/s00170-019-04383-w

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  • DOI: https://doi.org/10.1007/s00170-019-04383-w

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