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Pattern design of fixed abrasive pads inspired by the bee colony theory

  • Congfu Fang
  • Zhen Yan
  • Zhongwei Hu
  • Yanfen Lin
  • Zaixing Zhao
ORIGINAL ARTICLE

Abstract

Textured fixed-abrasive pads (T-FAPs) are pads that can be realized via slotting, arranging pellets, etc.; these pads have the advantages of good lapping performance due to the geometrical patterns (GPs) on the pad surface. GPs have an influence on lapping performance due to the global distribution of fixed abrasives changed by the various GPs; this work intended to design GPs for T-FAPs from the perspective of kinematic trajectory in order to further improve the lapping performance. For this purpose, an adaptive design method was demonstrated based on the bee colony theory and kinematic analysis. The T-FAP design algorithm was applied to search for appropriate GPs according to the constraint on the non-uniformity of trajectory (NUT), and the kinematic method was used to obtain the NUT induced by different GPs. Based on the method, new T-FAP patterns were readily designed, and their NUT were also compared with that of a traditional T-FAP pattern. Corresponding comparative experiments were conducted on a single side machine in lapping of sapphire slices with the designed and traditional T-FAPs. The surface profile, total thickness variation, surface roughness, and material removal due to the lapping were measured. According to the results, it was found that the designed T-FAP with the lower NUT can achieve better lapping performance in terms of lapping quality and efficiency, which validates the feasibility of the adaptive design method by restricting NUT during T-FAP design. Moreover, the values of NUT are affected more by the T-FAP patterns than by the lapping parameters. With the aid of the proposed method, the values of NUT induced by the designed T-FAPs can be readily restricted to less than 0.1, the minimum value is about 0.04, while the NUT value of the traditional T-FAP is about 0.2.

Keywords

Lapping pad Geometrical pattern Bee colony theory Trajectory Material removal 

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Notes

Funding information

This work was supported by the National Natural Science Foundation of China (grant numbers 51675193, 51305145), the Natural Science Foundation of Fujian Province (grant number 2016J01235), and the Promotion Program for Young and Middle-aged Teacher in Science and Technology Research of Huaqiao University (grant number ZQN-PY303).

References

  1. 1.
    Dong ZC, Cheng HB (2014) Study on removal mechanism and removal characters for SiC and fused silica by fixed abrasive diamond pellets. Int J Mach Tools Manuf 85:1–13CrossRefGoogle Scholar
  2. 2.
    Wang CL, Jin ZJ, Kang RK (2008) Effects of kinematic forms on material removal rate and non-uniformity in chemical mechanical planarization. Int J Mater Prod Technol 31:54–62CrossRefGoogle Scholar
  3. 3.
    Lee H, Lee D, Jeong H (2016) Mechanical aspects of the chemical mechanical polishing process: a review. Int J Precis Eng Manuf 17(4):525–536CrossRefGoogle Scholar
  4. 4.
    Li HN, Axinte D (2016) Textured grinding wheels: a review. Int J Mach Tools Manuf 109:8–35CrossRefGoogle Scholar
  5. 5.
    Lee S, Hwang E (2002) Smart pad fabrication for CMP. LMA Research Report 10:100–104Google Scholar
  6. 6.
    Rosales-Yeomans D, Doi T, Kinoshita M, Suzuki T, Philipossian A (2004) Effect of pad groove designs on the frictional and removal rate characteristics of ILD CMP. J Electrochem Soc 151(3):196–199CrossRefGoogle Scholar
  7. 7.
    Sousa FJP, Hossea DS, Reichenbach I, Aurich JC, Seewig J (2013) Influence of kinematics and abrasive configuration on the grinding process of glass. J Mater Process Technol 213(5):728–739CrossRefGoogle Scholar
  8. 8.
    Doy TK, Seshimo K, Suzuki K, Philipossian A, Kinoshita M (2004) Impact of novel pad groove designs on removal rate and uniformity of dielectric and copper CMP. J Electrochem Soc 151(3):G196–G199CrossRefGoogle Scholar
  9. 9.
    Muldowney GP (2005) On the relationship of CMP wafer nanotopography to groove-scale slurry transport. MRS Sympo Proc 867:259–274Google Scholar
  10. 10.
    Guo YC, Lee HC, Lee Y, Jeong H (2012) Effect of pad groove geometry on material removal characteristics in chemical mechanical polishing. Int J Precis Eng Manuf 13(2):303–306CrossRefGoogle Scholar
  11. 11.
    Hocheng H, Tsai HY, Tsai MS (2000) Effects of kinematic variables on non-uniformity in chemical mechanical planarization. Int J Mach Tools Manuf 40:1651–1669CrossRefGoogle Scholar
  12. 12.
    Tso PL, Wang YY, Tsai MJ (2001) A study of carrier motion on a dual face CMP machine. J Mater Process Technol 116:194–200CrossRefGoogle Scholar
  13. 13.
    Su JX, Guo DM, Kang RK, Jin ZJ, Li XJ, Tian YB (2004) Modeling and analyzing on nonuniformity of material removal in chemical mechanical polishing of silicon wafer. Mater Sci Forum 471-472:26–31CrossRefGoogle Scholar
  14. 14.
    Zhao DW, Wang TQ, He YY, Lu XC (2013) Kinematic optimization for chemical mechanical polishing based on statistical analysis of particle trajectories. IEEE Trans Semicond Manuf 26(4):556–563CrossRefGoogle Scholar
  15. 15.
    Yuan JL, Yao WF, Zhao P, Lyu BH, Chen ZX, Zhong MP (2015) Kinematics and trajectory of both cylindrical lapping process in planetary motion type. Int J Mach Tools Manuf 92:60–71CrossRefGoogle Scholar
  16. 16.
    Luo JF, Dornfeld DA (2003) Effects of abrasive size distribution in chemical mechanical planarization: modeling and verification. IEEE Trans Semicond Manuf 16(3):469–476CrossRefGoogle Scholar
  17. 17.
    Zuo DW, Sun YL, Zhao YF, Zhu YW (2009) Basic research on polishing with ice bonded nanoabrasive pad. J Vac Sci Technol 27(3):1514–1519CrossRefGoogle Scholar
  18. 18.
    Tam HY, Cheng HB (2010) An investigation of the effects of the tool path on the removal of material in polishing. J Mater Process Technol 210(5):807–818CrossRefGoogle Scholar
  19. 19.
    Choi JY, Jeong HD (2004) A study on polishing of molds using hydrophilic fixed abrasive pad. Int J Mach Tools Manuf 44:1163–1169CrossRefGoogle Scholar
  20. 20.
    Uhimann E, Ardelt T, Spur G (1999) Influence of kinematics on the face grinding process on lapping machines. Ann CIRP 48(1):281–284CrossRefGoogle Scholar
  21. 21.
    Nguyen NY, Zhong ZW, Tian Y (2015) An analytical investigation of pad wear caused by the conditioner in fixed abrasive chemical-mechanical polishing. Int J Adv Manuf Technol 77:897–905CrossRefGoogle Scholar
  22. 22.
    Baisie EA, Li ZC, Zhang XH (2013) Design optimization of diamond disk pad conditioners. Int J Adv Manuf Technol 66:2014–2052CrossRefGoogle Scholar
  23. 23.
    Dong ZC, Cheng HB, Tam HY (2012) Investigation on removal features of multi-distribution fixed abrasive diamond pellets used in the polishing of SiC mirrors. Appl Opt 51(35):9373–9382CrossRefGoogle Scholar
  24. 24.
    Hu ZW, Fang CF, Deng WW, Zhao ZX, Lin YF, Xu XP (2017) Speed ratio optimization for ceramic lapping with fixed diamond pellets. Int J Adv Manuf Technol 90:3159–3169CrossRefGoogle Scholar
  25. 25.
    Fang CF, Zhao ZX, Hu ZW (2017) Pattern optimization for phyllotactic fixed abrasive pads based on the trajectory method. IEEE Trans Semicond Manuf 30(1):78–85CrossRefGoogle Scholar
  26. 26.
    Fang CF, Zhao ZX, Lu LY, Lin YF (2017) Influence of fixed abrasive configuration on the polishing process of silicon wafers. Int J Adv Manuf Technol 88:575–584CrossRefGoogle Scholar
  27. 27.
    Chang WL, Zeng DZ, Ching RC, Guo S (2015) An artificial bee colony algorithm for data collection path planning in sparse wireless sensor networks. Int J Mach Learn Cybern 6(3):375–383CrossRefGoogle Scholar
  28. 28.
    Jayalakshmi B, Singh A (2017) A hybrid artificial bee colony algorithm for the cooperative maximum covering location problem. Int J Mach Learn Cybern 8(2):691–697CrossRefGoogle Scholar
  29. 29.
    Karaboga D, Basturk B (2007) A powerful and efficient algorithm for numerical function optimization: artificial bee colony (ABC) algorithm. J Glob Optim 39:459–471MathSciNetCrossRefzbMATHGoogle Scholar
  30. 30.
    Uneda M, Maeda Y, Ishikawa K, Ichikawa K, Doi T (2012) Relationships between contact image analysis results for pad surface texture and removal rate in CMP. J Electrochem Soc 159(2):90–95CrossRefGoogle Scholar
  31. 31.
    Preston F (1927) The theory and design of plate glass polishing machines. J Soc Glas Technol 11:214–256Google Scholar

Copyright information

© Springer-Verlag London Ltd., part of Springer Nature 2018

Authors and Affiliations

  • Congfu Fang
    • 1
  • Zhen Yan
    • 1
  • Zhongwei Hu
    • 1
  • Yanfen Lin
    • 2
  • Zaixing Zhao
    • 1
  1. 1.MOE Engineering Research Center for Machining of Brittle MaterialsHuaqiao UniversityXiamenChina
  2. 2.School of Electronic & Electrical EngineeringXiamen Institute of TechnologyXiamenChina

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