Diamond structure-dependent pad and wafer polishing performance during chemical mechanical polishing

  • Cheolmin Shin
  • Atul Kulkarni
  • Kangjun Kim
  • Hojoong Kim
  • Sanghuck Jeon
  • Eungchul Kim
  • Yinhua Jin
  • Taesung KimEmail author


A diamond conditioner is one of the essential components in the maintenance of surface roughness of a pad during chemical mechanical polishing (CMP). In this paper, four different types of diamond conditioner were evaluated for the pad wear rate (PWR) and the material removal rate (MRR) during the pad conditioning and the wafer polishing ex situ. The experiment results revealed that the pad conditioning is strongly dependent on the diamond orientation as compared to grit size and pitch. It is observed that the PWR for “C type” conditioners is about 0.3 mm/h which is higher than that of “N type” diamond conditioner. The COF of “N type” diamond conditioner has the lowest value of ~0.56. The MRR using pad treated by “N type” diamond conditioner is approximately 3500 Å/min, which is about 1.6 times higher than that of C1-type diamond conditioner which has same diamond grit size and pitch.


Chemical mechanical polishing Diamond conditioner Pad asperity Contact area 


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The authors are thankful to Shinhan Diamond Industrial Corporation, Republic of Korea for providing the diamond conditioners.

Funding information

This work was supported by a National Research Foundation of Korea (NRF) grant funded by the Korea government (MSIP) (NRF-2013R1A1A2058893).


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Copyright information

© Springer-Verlag London Ltd., part of Springer Nature 2018

Authors and Affiliations

  • Cheolmin Shin
    • 1
  • Atul Kulkarni
    • 2
  • Kangjun Kim
    • 3
  • Hojoong Kim
    • 4
  • Sanghuck Jeon
    • 5
  • Eungchul Kim
    • 1
  • Yinhua Jin
    • 6
  • Taesung Kim
    • 1
    • 6
    Email author
  1. 1.Department of Mechanical EngineeringSungkyunkwan UniversitySuwon-siRepublic of Korea
  2. 2.Symbiosis Centre for Nanoscience and nanotechnology (SCNN)Symbiosis International (Deemed University)PuneIndia
  3. 3.CMP DivisionShinhan Diamond Industrial CorporationIncheon-siRepublic of Korea
  4. 4.Cleaning/CMP Technology Team, Memory BusinessSamsung ElectronicsHwasung-siRepublic of Korea
  5. 5.Chemical Research InstituteLTCAM CorporationPyeongtaek-siRepublic of Korea
  6. 6.SKKU Advanced Institute of Nano Technology (SAINT)Sungkyunkwan UniversitySuwon-siRepublic of Korea

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