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Correction to: Establishing a theoretical model for abrasive removal depth of silicon wafer chemical mechanical polishing by integrating a polishing times analytical model and specific down force energy theory

  • Zone-Ching Lin
  • Ren-Yuan Wang
  • Zih-Wun Jhang
Correction
  • 89 Downloads

Copyright information

© Springer-Verlag London Ltd., part of Springer Nature 2018

Authors and Affiliations

  1. 1.Department of Mechanical EngineeringNational Taiwan University of Science and TechnologyTaipeiTaiwan
  2. 2.Department of Mechanical EngineeringArmy Academy R. O. CZhongli CityTaiwan

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