Skip to main content
SpringerLink
Log in

A grinding force model for ultrasonic assisted internal grinding (UAIG) of SiC ceramics

  • ORIGINAL ARTICLE
  • Published:
The International Journal of Advanced Manufacturing Technology Aims and scope Submit manuscript

Abstract

As grinding force plays an influential role in work-surface finish in grinding process, a model is necessary for optimizing input variables to achieve high product quality and productivity. However, to the best of our knowledge, there are few reports on modeling grinding force in ultrasonic assisted internal grinding (UAIG). In this study, a theoretical model is presented to predict the grinding force in UAIG of SiC ceramics. This model stems from undeformed chip length resulting from the relative motion between the grinding wheel and the workpiece. After analyzing the cutting action of an active individual grain, normal and tangential force models for the UAIG of SiC ceramics are developed. Using the developed model, the influence of many principal input variables, namely the workpiece rotational speed n w , the wheel infeed rate V c , the wheel rotational speed n g , the UV amplitude A u , and the oscillation frequency f o , on grinding force is predicted. Comparing the predicted forces with the experimental ones, it is shown that the predicted forces agree reasonably well with the experimental ones. The obtained results show that (1) the grinding forces are reduced in the UAIG compared to conventional internal grinding, which is attributed to the formation of the longer undeformed chip length in the UAIG; (2) the influence of n g , n w , and V c on grinding force are much pronounced, whereas that of A u and f o are not very noticeable; and (3) the force reduction of UV can be enhanced either by decreasing n g , n w , and V c or increasing A u and f o .

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. Nomura M (2007) Study of ultrasonic vibration assisted internal grinding of small holes. Doctoral Dissertation, Tohoku University

  2. Peng Y, Wu YB, Liang ZQ, Guo YB, Lin X (2011) An experimental study of ultrasonic vibration-assisted grinding of polysilicon using two-dimensional vertical workpiece vibration. Int J Adv Manuf Technol 54(9–12):941–947

    Article  Google Scholar 

  3. Peng Y, Liang Z, Wu Y, Guo Y, Wang C (2012) Effect of vibration on surface and tool wear in ultrasonic vibration-assisted scratching of brittle materials. Int J Adv Manuf Technol 59(1–4):67–72

    Article  Google Scholar 

  4. Peng Y, Liang Z, Wu Y, Guo Y, Wang C (2012) Characteristics of chip generation by vertical elliptic ultrasonic vibration-assisted grinding of brittle materials. Int J Adv Manuf Technol 62(5–8):563–568

    Article  Google Scholar 

  5. Junichiro K, Yoshihisa I (1961) Study on ultrasonic internal grinding by using the longitudinally vibrated grinding wheel: 2nd report, the outline of the effects. Trans Jpn Soc Mech Eng 27(181):1412–1418

    Article  Google Scholar 

  6. Wu Y, Nomura M, Kato M, Tachibana T (2003) Fundamental investigation of internal ultrasonic vibration assisted grinding of small holes. Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21, 2003: 145–150

  7. Fujimoto M, Wu Y, Cao J (2011) High Precision Ultrasonically Assisted Internal Grinding (UAIG) of Difficult-to-machining Materials using Metal Bonded Diamond Wheels, Proceedings of The 6th International Conference on Leading Edge Manufacturing in 21st Century, Saitama, Japan, 2011

  8. Cao Jianguo, W Yongbo, L Dong, Fujimoto M, Mitsuyoshi N (2014) Fundamental machining characteristics of ultrasonic assisted internal grinding of SiC ceramics. Mater Manuf Process 29(5):557–563

    Article  Google Scholar 

  9. Cao Jianguo, W Yongbo, L Dong, Fujimoto M, Mitsuyoshi N (2014) Material removal behavior in ultrasonic-assisted scratching of SiC ceramics with a single diamond tool. Int J Mach Tools Manuf 79:49–61

    Article  Google Scholar 

  10. Nomura Mitsuyoshi W, Yongbo KM, Toru T, Tsunemoto K (2005) Study of internal ultrasonic vibration assisted grinding of small bore: mechanism of grinding force reduction due to ultrasonic vibration. J Jpn Soc Abras Technol 49(12):691–696 (In Japanese)

  11. Keita S, Takumi T, Nobuhito Y, Jiwang Y, Tsunemoto K (2009) Ultrasonic-assisted micro-grinding with electroplated diamond wheels. J Jpn Soc Abras Technol 53(1):45–48 (In Japanese)

  12. Qin N, Pei ZJ, Treadwell C, Guo DM (2009) Physics-based predictive cutting force model in ultrasonic-vibration-assisted grinding for titanium drilling. J Manuf Sci Eng 131(4):041001-1–041001-9

    Article  Google Scholar 

  13. Yan W, Bin L, Xiaofeng Z (2014) Research on the system matching model in ultrasonic vibration-assisted grinding. Int J Adv Manuf Technol 70(1–4):449–458

    Google Scholar 

  14. Kun L, Warren L (1997) Modelling of ceramic grinding processes Part I. Number of cutting points and grinding forces per grit. J Mater Process Technol 65(1):1–10

    Google Scholar 

  15. Syoji K (2004) Grinding manufacturing. Yokendo, Tokyo

    Google Scholar 

  16. Arfken G (1984) University physics. Academic, Massachusetts

  17. Sanjay A, Venkateswara RP (2013) Predictive modeling of force and power based on a new analytical undeformed chip thickness model in ceramic grinding. Int J Mach Tools Manuf 65:68–78

    Article  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. School of Mechanical, Electronic and Control Engineering, Beijing Jiaotong University, Beijing, 100044, People’s Republic of China

    Jianguo Cao, Jianyong Li & Qinjian Zhang

  2. Department of Machine Intelligence and Systems Engineering, Akita Prefectural University, Yurihonjo, Akita, 015-0055, Japan

    Yongbo Wu

Authors
  1. Jianguo Cao
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Yongbo Wu
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Jianyong Li
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Qinjian Zhang
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Yongbo Wu.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Cao, J., Wu, Y., Li, J. et al. A grinding force model for ultrasonic assisted internal grinding (UAIG) of SiC ceramics. Int J Adv Manuf Technol 81, 875–885 (2015). https://doi.org/10.1007/s00170-015-7282-0

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s00170-015-7282-0

Keywords

Search

Navigation