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Experimental investigation on the machining characteristics of single-crystal SiC sawing with the fixed diamond wire

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Abstract

Machining characteristics and surface profiles were systematically investigated during the fixed abrasive diamond wire sawing of single-crystal silicon carbide (SiC). The material removal mechanism involved in the sawing was explored. The scanning electron micrographs examination and the result of surface roughness of the sawn surface and the analysis of the force and specific sawing energy involved in the sawing process indicated that the material removal of single-crystal SiC sawing with fixed diamond wire was dominated by brittle fracture. However, more ploughing striations were obtained in the sawn surface under high wire speed. The sawn surface of the single-crystal SiC indicated the periodical waviness was caused by the reciprocating movement of the fixed diamond wire. The specific sawing energy showed a rapid increase with the decrease of the material removal volume per length of wire when it was below a critical value.

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References

  1. Friedrichs P, Kimoto T, Ley L, Pensl G (2009) Silicon carbide, vol 1: growth, defects, and novel applications. Wiley-VCH Verlag GmbH&Co KGaA, Weinheim. doi:10.1002/ 9783527629053

    Book  Google Scholar 

  2. Friedrichs P, Kimoto T, Ley L, Pensl G (2009) Silicon carbide, vol 2, Power devices and sensors. Wiley-VCH Verlag GmbH&Co KGaA, Weinheim, Germany. doi:10.1002/ 9783527629 077

    Book  Google Scholar 

  3. Hsu CY, Chen CS, Tsao CC (2009) Free abrasive wire saw machining of ceramics. Int J Adv Manuf Technol 40:503–511. doi:10.1007/s00170-007-1355-7

    Article  Google Scholar 

  4. Guimarães L, Santos R, Lobo BA (2011) Scheduling wafer slicing by multi-wire saw manufacturing in photovoltaic industry: a case study. Int J Adv Manuf Technol 53:11293–1139. doi:10.1007/s00170-010-2906-x

    Article  Google Scholar 

  5. Chung CH, Tsay GD, Tsai MH (2014) Distribution of diamond grains in fixed abrasive wire sawing process. Int J Adv Manuf Technol 73:1485–1494. doi:10.1007/s00170-014-5782-y

    Article  Google Scholar 

  6. Cvetković S, Morsbach C, Rissing L (2011) Ultra-precision dicing and wire sawing of silicon carbide (SiC). Microelectron Eng 88:2500–2504. doi:10.1016/j.mee.2011.02.026

    Article  Google Scholar 

  7. Hardin CW, Qu J, Shih AJ (2004) Fixed abrasive diamond wire saw slicing of single-crystal silicon carbide wafers. Mater Manuf Process 19:355–367. doi:10.1081/amp-120029960

    Article  Google Scholar 

  8. Wang XY, Li Y, Li SJ (2011) Study on the impact of the cutting process of wire saw on sic wafers. Appl Mech Mater 120:593–597. doi:10.4028/www.scientific.net/AMM.120.593

    Article  Google Scholar 

  9. Li SJ, Wan B, Landers RG (2014) Surface roughness optimization in processing SiC monocrystal wafers by wire saw machining with ultrasonic vibration. P I Mech Eng B J Eng 288:725–739. doi:10.1177/0954405413508116

    Google Scholar 

  10. Yin L, Vancoille EYJ, Ramesh K, Huang H (2004) Surface characterization of 6H-SiC (0001) substrates in indentation and abrasive machining. Int J Mach Tool Manu 44:607–615. doi:10.1016/j.ijmachtools.2003.12.006

    Article  Google Scholar 

  11. Yan J, Zhang Z, Kuriyagawa T (2009) Mechanism for material removal in diamond turning of reaction-bonded silicon carbide. Int J Mach Tool Manu 49:366–374. doi:10.1016/j.ijmachtools.2008.12.007

    Article  Google Scholar 

  12. Yu X, Wang P, Li X, Yang D (2012) Thin czochralski silicon solar cells based on diamond wire sawing technology. Sol Energ Mat Sol C 98:337–342. doi:10.1016/j.solmat.2011.11.028

    Article  Google Scholar 

  13. Xu LM, Shen B, Shih AJ (2006) Vitreous bond silicon carbide wheel for grinding of silicon nitride. Int J Mach Tool Manu 46:631–639. doi:10.1016/j.ijmachtools.2005.07.008

    Article  Google Scholar 

  14. Rhoney BK, Shih AJ, Scattergood RO, Akenom JL, Gust DJ, Grant MB (2002) Wire electrical discharge machining of metal bond diamond wheels for ceramic grinding. Int J Mach Tool Manu 42:1355–1362. doi:10.1016/S0890-6955(02)00056-1

    Article  Google Scholar 

  15. Hwang TW, Malkin S (1999) Grinding mechanisms and energy balance for ceramics. J Manuf Sci E-T ASME 121:623–631. doi:10.1115/1.2833081

    Article  Google Scholar 

  16. Huang H, Liu YC (2003) Experimental investigations of machining characteristics and removal mechanisms of advanced ceramics in high speed deep grinding. Int J Mach Tool Manu 43:811–823. doi:10.1016/s0890-6955(03) 00050-6

    Article  Google Scholar 

  17. Inasaki I (1987) Grinding of hard and brittle materials. CIRP Ann-Manuf Techn 36:463–471. doi:10.1016/ S0007-8506(07)60748-3

    Article  Google Scholar 

  18. Yin L, Huang H, Ramesh K, Huang T (2005) High speed versus conventional grinding in high removal rate machining of alumina and alumina–titania. Int J Mach Tool Manu 45:897–907. doi:10.1016/j.ijmachtools. 2004.10. 016

    Article  Google Scholar 

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Authors and Affiliations

  1. Institute of Manufacturing Engineering, Huaqiao University, No. 668 Jimei Avenue, Jimei Distract, Xiamen, 361021, Fujian Province, People’s Republic of China

    Hui Huang, Yuxing Zhang & Xipeng Xu

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  1. Hui Huang
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  2. Yuxing Zhang
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  3. Xipeng Xu
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Correspondence to Hui Huang.

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Huang, H., Zhang, Y. & Xu, X. Experimental investigation on the machining characteristics of single-crystal SiC sawing with the fixed diamond wire. Int J Adv Manuf Technol 81, 955–965 (2015). https://doi.org/10.1007/s00170-015-7250-8

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  • DOI: https://doi.org/10.1007/s00170-015-7250-8

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