Slicing parameters optimizing and experiments based on constant wire wear loss model in multi-wire saw

Abstract

Multi-wire saw becomes the dominant method in slicing the hard brittle material into wafers. In this process, saw wire is the critical consumable and the dominant component of the wafer’s slicing cost. However, unreasonable process parameters lead to the fact that the saw wire was not fully used. This enormously increases the wire cost. For this reason, the constant wire wear loss model is presented by taking the free abrasive wire sawing as an example. This model takes the various cutting conditions into account and ensures the whole wire wear loss to reach the preset reasonable value. Firstly, a hypothesis that there is a mapping relation between the wire wear loss and the wire slicing area during the wire lifetime is built. According to this hypothesis, the wire allowed wear loss can be transformed into wire allowed slicing area. Secondly, the calculation method is deduced based on the model. The function relation is obtained between the wire feedback ratio and the actual slicing conditions under the constraint condition of the preset wire wear allowed loss. This rational feedback ratio of wire is obtained based on the actual process parameters. Thirdly, experiments are carried out. The results indicate that the relation between wire wear loss and wire slicing area is linear under the condition of the experiments and the wire consumption is reduced obviously. Meanwhile, wafers’ quality meets the requirements. This method can effectively save saw wire cost, referring to slicing other hard brittle materials by multi-wire saw.