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Research on single-point diamond fly-grooving of brittle materials

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Abstract

The purpose of this paper is to investigate the machining mechanisms that accompany the single-point diamond fly-cutting operation in grooving of brittle materials. Single-point diamond fly-cutting is widely used in precision machining of free-form optics, semiconductor devices, and micro-electromechanical system (MEMS) components among many others. The undeformed chip zone was analyzed and its relation to the critical brittle/ductile transition depth of cut was discussed. Then, a mechanics-based model was proposed to describe the material stress condition under the diamond tool. The machining parameters were incorporated into the model to understand fly-cutting behavior. It was shown that the fly-cutting technique is highly suitable for the ductile removal of brittle materials by generating large compressive pressures in the chip formation zone. This condition can be further enhanced by a small feedrate and a large negative rake angle of the diamond tool used. The theoretical results were substantiated and verified by fly-grooving experiments performed on mono-crystalline silicon.

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Authors and Affiliations

  1. Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen, 361005, China

    Y. Peng & T. Jiang

  2. Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60201, USA

    Y. Peng & K. F. Ehmann

Authors
  1. Y. Peng
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  2. T. Jiang
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  3. K. F. Ehmann
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Correspondence to Y. Peng.

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Peng, Y., Jiang, T. & Ehmann, K.F. Research on single-point diamond fly-grooving of brittle materials. Int J Adv Manuf Technol 75, 1577–1586 (2014). https://doi.org/10.1007/s00170-014-6245-1

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  • DOI: https://doi.org/10.1007/s00170-014-6245-1

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