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A novel prediction model for thin plate deflections considering milling residual stresses

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Abstract

Residual stresses induced by machining coupled with the initial stresses can significantly impact mechanical properties of workpieces such as distortion, corrosion resistance, and dimensional stability. The redistribution pattern of residual stresses is extremely complex. The stress relieving can seriously deform the workpieces and reduce the fatigue life. Therefore, deflection prediction is critical for design, control, analysis, and management of machining. In this paper, an integrated modeling method is introduced to predict the deflection caused by milling residual stresses, to be more exact, to map the relationship between the deflections and the cutting parameters. Response surface design (RSD) is utilized to develop a new mathematical model which can predict the residual stress profiles of the workpieces along the cutting direction based on different cutting parameters. Then, the deflections are derived based on the estimated stress profiles and mechanics of materials theory. A finite element analysis model (FEM)-based simulation experiment using aluminum alloy 6061 as a case study has been implemented. The results from experiments indicate that the proposed approach could precisely estimate the residual stress profiles for given cutting parameters and effectively predict the deflections of the workpieces caused by residual stress.

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Authors and Affiliations

  1. School of Mechanical Engineering, Shandong University, Ji’nan, People’s Republic of China, 250061

    Zhaoliang Jiang, Yumei Liu & Weixian Shao

  2. Department of Mechanical and Industrial Engineering, University of Illinois at Chicago, Chicago, IL, 60607, USA

    Lin Li

Authors
  1. Zhaoliang Jiang
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  2. Yumei Liu
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  3. Lin Li
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  4. Weixian Shao
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Correspondence to Lin Li.

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Jiang, Z., Liu, Y., Li, L. et al. A novel prediction model for thin plate deflections considering milling residual stresses. Int J Adv Manuf Technol 74, 37–45 (2014). https://doi.org/10.1007/s00170-014-5952-y

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  • DOI: https://doi.org/10.1007/s00170-014-5952-y

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