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Investigating and removing the re-sticky debris on tungsten carbide in electrical discharge machining

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Abstract

Electrical discharge machining (EDM) is an excellent method to machine tungsten carbide with high hardness and high toughness. However, debris from this material produced by EDM re-sticking on the workpiece surface remarkably affects working efficiency and dimension precision. Therefore, this study investigated the re-sticky phenomenon of tungsten carbide and how to reduce the debris re-sticking on the workpiece surface. In general, the polarity in EDM depended on the different electrical parameters of the machine input and the different materials of the tool electrode. The first item of investigation observed the re-sticky position of the debris to study the effect of different polarities during the EDM process. Next, the tool electrode was set at different conditions without rotation and with a 200 rpm rotational speed to evaluate the rotating effect in EDM. Finally, different lift distances of the electrode and different shapes of electrode with rotation were utilized to investigate the improvement for reducing debris re-sticking on the machining surface. The results showed that only negative polarity in EDM could cause the re-sticky phenomenon on tungsten carbide. On the other hand, debris would notably re-stick on any machining position when the tool electrode was not rotated in EDM. Besides, debris significantly stuck on the center of the working area with rotation of the electrode. Additionally, a larger lift distance of the tool electrode could reduce debris re-sticking on the working surface, but this process would decrease material removal rate in EDM. In the end, a special shaped design of the tool electrode resulted in the re-sticky debris completely vanishing, when the electrode width was 0.6 times the diameter of this cylindrical electrode.

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Correspondence to A-Cheng Wang.

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Chou, SH., Wang, AC. Investigating and removing the re-sticky debris on tungsten carbide in electrical discharge machining. Int J Adv Manuf Technol 71, 1151–1158 (2014). https://doi.org/10.1007/s00170-013-5556-y

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  • DOI: https://doi.org/10.1007/s00170-013-5556-y

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