Development of a feedstock formulation based on polypropylene for micro-powder soft embossing process of 316L stainless steel micro-channel part

Abstract

To exploit the potential of micro-system technology, the micro-powder embossing process, a rapid manufacturing production technology of microstructured die mould, was currently being investigated. Present work focused on establishing a suitable binder system for micro-powder embossing process. Multi-component binder systems, comprising of different weight percentages of paraffin wax, stearic acid and polypropylene were investigated. The compatibility between binder constituents was studied by thermogravimetric analysis (TGA) showing a partial miscibility between both components. The feedstock comprised of 316L stainless steel powder, and a wax-based thermoplastic binder was used to achieve a feedstock with 60 to 68 vol.% powder loading. The degradation temperature of binders was determined by using TGA and flow behaviour through rheometer. Homogeneity of the feedstock was verified by using TGA and scanning electron microscopy. Then, hot embossing was done, and it was found that the feedstock having solid loading up to 68 vol.% were successfully embossed, and components were without physical defects. The polymeric part was driven off by thermal debinding using a thermal cycle designed on the basis of a thermogravimetric study of the binder. Finally, the vacuum sintering of the parts allows high quality parts to be obtained.