Abstract
In this study, wire electrical discharge machining (WEDM) was implemented to process polycrystalline silicon ingot (electric resistance, 2–3 Ω cm), and the influences on surface characteristics were examined. At first, two different dielectrics, pure water and pure water with sodium pyrophosphate powder, were experimented to compare their effects on cutting speed and surface roughness. In the experiment, pure water with sodium pyrophosphate powder has shown that it enhanced process efficiency and improved surface smoothness. Then, the effects on cutting efficiency with different concentrations were examined; 0.05 M was chosen for its best performance. After setting the concentration, several experiments were conducted to find out how different currents and pulse-on times affect the cutting efficiency and surface roughness. The findings in this study prove that using phosphorous dielectric on WEDM could be applied onto polycrystalline silicon cutting. In addition, pure water with sodium pyrophosphate powder increases both working efficiency and improves infiltration of the phosphorous element on the surface. These findings could be future references on researches of solar cell in both industrial and academic fields.
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References
Moller HJ, Funke C, Rinio M, Scholz S (2005) Multicrystalline silicon for solar cells. Thin Solid Films 487(1–2):179–187
Moller HJ (2004) Basic mechanisms and models of multi-wire sawing. Adv Eng Mater 6(7):501–513
Moller HJ (2006) Wafering of silicon crystals. Phys Status Solidi A 203(4):659–669
Ming PM, Zhu D, Zeng YB, Hu YY (2010) Wear resistance of copper EDM tool electrode electroformed from copper sulfate baths and pyrophosphate baths. Int J Adv Manuf Tech 50(5–8):635–641
Tai TY, Lu SJ, Chen YH (2011) Surface crack susceptibility of electro discharge-machined steel surfaces. Int J Adv Manuf Tech 57(9–12):983–989
Mai C, Hocheng H, Huang S (2012) Advantages of carbon nanotubes in electrical discharge machining. Int J Adv Manuf Technol 59(1–4):111–117
Bhattacharya A, Batish A, Singh G, Singla VK (2012) Optimal parameter settings for rough and finish machining of die steels in powder-mixed EDM. Int J Adv Manuf Technol 61(5–8):537–548
Wei C, Zhao L, Hu D, Ni J (2013) Electrical discharge machining of ceramic matrix composites with ceramic fiber reinforcements. Int J Adv Manuf Technol 64(1–4):187–194
Woo YM, Yeo SH, Tan PC (2013) Critical wall thickness in electrical discharge machining. Int J Adv Manuf Technol 64(5–8):821–828
Patil NG, Brahmankar PK (2010) Some studies into wire electro-discharge machining of alumina particulate-reinforced aluminum matrix composites. Int J Adv Manuf Technol 48(5–8):537–555
Gauria SK, Chakraborty S (2010) A study on the performance of some multi-response optimisation methods for WEDM processes. Int J Adv Manuf Technol 49(1–4):155–166
Jangra K, Grover S, Aggarwal A (2011) Digraph and matrix method for the performance evaluation of carbide compacting die manufactured by wire EDM. Int J Adv Manuf Technol 54(5–8):579–591
Satishkumar D, Kanthababu M, Vajjiravelu V, Anburaj R, Sundarrajan T, Arul H (2011) Investigation of wire electrical discharge machining characteristics of Al6063/SiCp composites. Int J Adv Manuf Technol 56(9–12):975–986
Kumar K, Agarwal S (2012) Multi-objective parametric optimization on machining with wire electric discharge machining. Int J Adv Manuf Technol 62(5–8):617–633
Fonda P, Katahira K, Kobayashi Y, Yamazaki K (2012) WEDM condition parameter optimization for PCD microtool geometry fabrication process and quality improvement. Int J Adv Manuf Technol 63(9–12):1011–1091
Luo YF, Chen CG, Tong ZF (1992) Investigation of silicon wafering by wire EDM. J Mater Sci 27(21):5805–5810
Peng WY, Liao YS (2003) Study of electrical discharge machining technology for slicing silicon ingots. J Mater Process Technol 140(1–3):274–279
Jahan MP, Lieh TW, Wong YS, Rahman M (2011) An experimental investigation into the micro-electrodischarge machining behavior of P-type silicon. Int J Adv Manuf Technol 57(5–8):617–637
Takion H, Ichinohe T, Tanimoto K, Yamaguchi S, Nomura K, Kunieda M (2004) Cutting of polished single-crystal silicon by wire electrical discharge machining. Precis Eng 28(3):314–319
Takion HT, Ichinohe K, Tanimoto S, Yamaguchi K, Nomura M (2005) High-quality cutting of polished single crystal silicon by wire electrical discharge machining. Precis Eng 29(4):423–430
Takion H, Ichinohe T, Tanimoto K, Nomurak K, Kuniedai N (2007) Contouring of polished single-crystal silicon plates by wire electrical discharge machining. Precis Eng 31(4):358–363
Wang W, Liu ZD, Tian ZJ, Huang YH, Liu ZX (2009) High efficiency slicing of low resistance silicon ingot by wire electrolytic-spark hybrid machining. J Mater Process Technol 209(7):3149–3155
Yu PH, Lee HK, Lin YX, Qin SJ, Yan BH, Huang FY (2011) Machining characteristics of polycrystalline silicon by wire electrical discharge machining. Mater Manuf Process 26(12):1443–1450
Yu PH, Wu KL, Lee SM, Yan BH (2011) Effect of voltage supply mode on electrolytic machining of polycrystalline silicon. Mater Manuf Process 26(12):1459–1465
Yu PH, Lin YX, Lee HK, Mai CC, Yan BH (2011) Improvement of wire electrical discharge machining efficiency in machining polycrystalline silicon with auxiliary-pulse voltage supply. Int J Adv Manuf Technol 57(9–12):991–1001
Kunieda M, Qjima S (2000) Improvement of EDM efficiency of silicon single crystal through ohmic contact. Precis Eng 24(3):185–190
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Yeh, CC., Wu, KL., Lee, JW. et al. Study on surface characteristics using phosphorous dielectric on wire electrical discharge machining of polycrystalline silicon. Int J Adv Manuf Technol 69, 71–80 (2013). https://doi.org/10.1007/s00170-013-4995-9
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DOI: https://doi.org/10.1007/s00170-013-4995-9