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Uniformity and signal-to-noise ratio for static and dynamic parameter designs of deposition processes

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Abstract

In this paper, the relationship between the uniformity measure (U) and the Taguchi signal-to-noise ratio (SNR) for parameter design (or robust design) is investigated with a focus on the deposition process. For the static parameter design, it can be easily shown that U is directly related to the Taguchi SNR, and, as such, U can be interpreted as a measure directly related to the expected loss after the mean thickness is adjusted to the target. For the dynamic parameter design in which the target of a characteristic (e.g., the target thickness for a deposition process) changes, the Taguchi SNR is conditional on the signal parameter values (e.g., the deposition times) used in the parameter design experiment. Therefore, a new performance measure is developed considering a general distribution of the target thickness, and it is shown that U is also equivalent to this new performance measure. In summary, U can be used as a valid performance measure for the dynamic as well as static parameter design of a deposition process. Based on these findings, static and dynamic parameter design procedures for a deposition process are developed considering not only U but also the deposition rate, and the proposed dynamic procedure is illustrated with an example case study.

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References

  1. Guo RS, Sachs E (1993) Modeling, optimization and control of spatial uniformity in manufacturing processes. IEEE Trans Semicond Manuf 6(1):41–57

    Article  Google Scholar 

  2. Buie MJ, Pender JTP, Dahimene M (1998) Characterization of the etch rate non-uniformity in a magnetically enhanced reactive ion etcher. J Vac Sci Technol A16(3):1464–1468

    Google Scholar 

  3. Wang GJ, Chen JL, Hwang JY (2001) New optimization strategy for chemical mechanical polishing process. JSME Int J Ser C44(2):534–543

    Article  Google Scholar 

  4. Taguchi G, Phadke MS (1984) Quality engineering through design optimization. In: Proceedings of GLOBECOM 84 Meeting, Atlanta, Georgia. pp. 1106–1113

  5. Taguchi G, Yokoyama Y (1993) Taguchi methods: design of experiments, Quality engineering 4. ASI, Dearborn

    Google Scholar 

  6. Smith T, Boning D, Fang S, Shinn G, Stefani J (1990) A study of within-wafer non-uniformity metrics. In: Proceedings of the 4th International Workshop on Statistical Metrology, Kyoto, Japan. pp. 46–49

  7. Olson JM (2002) Analysis of LPCVD process conditions for the deposition of low stress silicon nitride. part I: preliminary LPCVD experiments. Mater Sci Semicond Process 5(1):51–60

    Article  Google Scholar 

  8. Takeuchi J, Mizuno T (2005) Development of scan coating by using parameter design of the Taguchi method. IEEE Trans Semicond Manuf 18(4):554–560

    Article  Google Scholar 

  9. Hong CC, Yen YR, Su JL, Hwu JG (2002) Improvement in ultrathin rapid thermal oxide uniformity by the control of gas flow. IEEE Trans Semicond Manuf 15(1):102–107

    Article  Google Scholar 

  10. Shie JR, Yang YK (2008) Optimizations of a photoresist coating process for photolithography in wafer manufacture via a radial basis neural network: a case study. Microelectron Eng 85(7):1664–1670

    Article  Google Scholar 

  11. Murphy TE, Tsui KL, Allen JK (2005) A review of robust design methods for multiple responses. Res Eng Des 16(3):201–215

    Article  Google Scholar 

  12. Dharmadhikari VS, Lynch RO, Brennan W, Cronin W, Rastogi R (1990) Physical vapor deposition equipment evaluation and characterization using statistical methods. J Vac Sci Technol A 8(3):1603–1607

    Article  Google Scholar 

  13. Hsia WJ, Hwan M (1993) Parameter design of a PECVD oxide process using dynamic characteristic. In: Proceedings of the 11th Symposium on Taguchi Methods, Dearborn, Michigan. pp. 87–102

  14. Taguchi G (1987) System of experimental design, vol 2. UNIPUB/Karus International Publication and ASI, White Plains, New York

    Google Scholar 

  15. Kohler WA (1970) Structural properties of vapor deposited silicon nitride. Metall Mater Trans B 1(3):735–740

    Article  Google Scholar 

  16. Hsieh KL, Tong LI, Chiu HP, Yeh HY (2005) Optimization of a multi-response problem in Taguchi’s dynamic system. Comput Ind Eng 49(4):556–571

    Article  Google Scholar 

  17. Wu FC, Yeh CH (2005) Robust design of multiple dynamic quality characteristics. Int J Adv Manuf Technol 25(5–6):579–588

    Article  Google Scholar 

  18. Robinson TJ, Borror CM, Myers RH (2004) Robust parameter design: a review. Qual Reliab Eng Int 20(1):81–101

    Article  Google Scholar 

  19. Tsui KL (1999) Modeling and analysis of dynamic robust design experiments. IIE Trans 31(12):1113–1122

    Google Scholar 

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Correspondence to Bong-Jin Yum.

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Jung, JR., Yum, BJ. Uniformity and signal-to-noise ratio for static and dynamic parameter designs of deposition processes. Int J Adv Manuf Technol 54, 619–628 (2011). https://doi.org/10.1007/s00170-010-2957-z

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  • DOI: https://doi.org/10.1007/s00170-010-2957-z

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