Abstract
In this paper, the relationship between the uniformity measure (U) and the Taguchi signal-to-noise ratio (SNR) for parameter design (or robust design) is investigated with a focus on the deposition process. For the static parameter design, it can be easily shown that U is directly related to the Taguchi SNR, and, as such, U can be interpreted as a measure directly related to the expected loss after the mean thickness is adjusted to the target. For the dynamic parameter design in which the target of a characteristic (e.g., the target thickness for a deposition process) changes, the Taguchi SNR is conditional on the signal parameter values (e.g., the deposition times) used in the parameter design experiment. Therefore, a new performance measure is developed considering a general distribution of the target thickness, and it is shown that U is also equivalent to this new performance measure. In summary, U can be used as a valid performance measure for the dynamic as well as static parameter design of a deposition process. Based on these findings, static and dynamic parameter design procedures for a deposition process are developed considering not only U but also the deposition rate, and the proposed dynamic procedure is illustrated with an example case study.
Similar content being viewed by others
References
Guo RS, Sachs E (1993) Modeling, optimization and control of spatial uniformity in manufacturing processes. IEEE Trans Semicond Manuf 6(1):41–57
Buie MJ, Pender JTP, Dahimene M (1998) Characterization of the etch rate non-uniformity in a magnetically enhanced reactive ion etcher. J Vac Sci Technol A16(3):1464–1468
Wang GJ, Chen JL, Hwang JY (2001) New optimization strategy for chemical mechanical polishing process. JSME Int J Ser C44(2):534–543
Taguchi G, Phadke MS (1984) Quality engineering through design optimization. In: Proceedings of GLOBECOM 84 Meeting, Atlanta, Georgia. pp. 1106–1113
Taguchi G, Yokoyama Y (1993) Taguchi methods: design of experiments, Quality engineering 4. ASI, Dearborn
Smith T, Boning D, Fang S, Shinn G, Stefani J (1990) A study of within-wafer non-uniformity metrics. In: Proceedings of the 4th International Workshop on Statistical Metrology, Kyoto, Japan. pp. 46–49
Olson JM (2002) Analysis of LPCVD process conditions for the deposition of low stress silicon nitride. part I: preliminary LPCVD experiments. Mater Sci Semicond Process 5(1):51–60
Takeuchi J, Mizuno T (2005) Development of scan coating by using parameter design of the Taguchi method. IEEE Trans Semicond Manuf 18(4):554–560
Hong CC, Yen YR, Su JL, Hwu JG (2002) Improvement in ultrathin rapid thermal oxide uniformity by the control of gas flow. IEEE Trans Semicond Manuf 15(1):102–107
Shie JR, Yang YK (2008) Optimizations of a photoresist coating process for photolithography in wafer manufacture via a radial basis neural network: a case study. Microelectron Eng 85(7):1664–1670
Murphy TE, Tsui KL, Allen JK (2005) A review of robust design methods for multiple responses. Res Eng Des 16(3):201–215
Dharmadhikari VS, Lynch RO, Brennan W, Cronin W, Rastogi R (1990) Physical vapor deposition equipment evaluation and characterization using statistical methods. J Vac Sci Technol A 8(3):1603–1607
Hsia WJ, Hwan M (1993) Parameter design of a PECVD oxide process using dynamic characteristic. In: Proceedings of the 11th Symposium on Taguchi Methods, Dearborn, Michigan. pp. 87–102
Taguchi G (1987) System of experimental design, vol 2. UNIPUB/Karus International Publication and ASI, White Plains, New York
Kohler WA (1970) Structural properties of vapor deposited silicon nitride. Metall Mater Trans B 1(3):735–740
Hsieh KL, Tong LI, Chiu HP, Yeh HY (2005) Optimization of a multi-response problem in Taguchi’s dynamic system. Comput Ind Eng 49(4):556–571
Wu FC, Yeh CH (2005) Robust design of multiple dynamic quality characteristics. Int J Adv Manuf Technol 25(5–6):579–588
Robinson TJ, Borror CM, Myers RH (2004) Robust parameter design: a review. Qual Reliab Eng Int 20(1):81–101
Tsui KL (1999) Modeling and analysis of dynamic robust design experiments. IIE Trans 31(12):1113–1122
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Jung, JR., Yum, BJ. Uniformity and signal-to-noise ratio for static and dynamic parameter designs of deposition processes. Int J Adv Manuf Technol 54, 619–628 (2011). https://doi.org/10.1007/s00170-010-2957-z
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s00170-010-2957-z