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Spatial resolution-based kinematic design of a parallel positioning platform

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Abstract

This paper presents a new algorithm for designing a two degrees-of-freedom platform, based on parallel kinematics, for the positioning and orientation of two high-precision cameras. It describes possible configurations for obtaining a pan–tilt system. The resolution of open-loop chains for each of the system’s legs provides the geometric parameters by resorting to the well-known Denavit–Hartenberg method. The configuration chosen avoids collisions between the components of the system for the azimuth and elevation movements required. A new algorithm to improve the design of the platform, which main objective is to improve the movement resolution, is presented. Obtaining the maximum possible resolution will allow us to reach, subsequently, higher positioning accuracy after performing the parameter identification process. First of all, the algorithm calculates the geometric parameters to improve the movement resolution. Next, the algorithm takes the physical constraints imposed by the system into account and obtains the design parameters necessary to reach the desired workspace. This mechanism is intended to be used in metrology applications and machining tool processes and endowed with maximum possible resolution, small dimensions and which reaches the desired workspace. This methodology can be easily adapted to be used along with other mechanisms, such as those which require high-positioning resolution.

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Authors and Affiliations

  1. Department of Design and Manufacturing Engineering, C.P.S. University of Zaragoza, C/María de Luna N° 3, Edif. Torres Quevedo, 50018, Zaragoza, Spain

    Ana Cristina Majarena, Jorge Santolaria, David Samper & Juan Jose Aguilar Martin

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  1. Ana Cristina Majarena
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  2. Jorge Santolaria
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  3. David Samper
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  4. Juan Jose Aguilar Martin
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Correspondence to Ana Cristina Majarena.

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Majarena, A.C., Santolaria, J., Samper, D. et al. Spatial resolution-based kinematic design of a parallel positioning platform. Int J Adv Manuf Technol 53, 1149–1165 (2011). https://doi.org/10.1007/s00170-010-2878-x

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  • DOI: https://doi.org/10.1007/s00170-010-2878-x

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