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3D finite element modeling of face milling of continuous chip material

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Abstract

Milling operations are very common in manufacturing. Often it represents the last operation, determining the final product quality. Then an accurate mathematical model is important in order to design the cutting process, in terms of cutting process, and the geometry of the insert, for tool manufacturers. The finite element modeling (FEM) simulation permits the prediction of the cutting forces, stresses, and temperatures of the cutting process. The 2D FEM can be a reasonable approximation, where the deformation can be considered plain. For the milling operations, this assumption can be suitable if the depth of cut is much bigger than nose radius. But in the normal situation the insert has a complex geometry and the bidimensional model of the milling operation is not appropriate. The 3D FEM involves different element formulations, different remeshing algorithm, and different boundary conditions, so an independent approach is necessary. The approach followed in this paper is to model three-dimensionally the milling operation, considering the real geometry of the insert. The FEM simulation is carried out with a commercial code (3D DEFORM™). First the rheological model has been calibrated using OXCUT software, developed at the ERC/NSM, and a sensitivity analysis about friction model has been performed. Milling tests are conducted and the measured cutting forces are compared to finite element modeling results. The results show an acceptable agreement with experimental results in the range of cutting speed and feed rate considered.

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Authors and Affiliations

  1. Department of Mechanical Engineering, Politecnico di Milano, Via La Masa 1, 20156, Milan, Italy

    Gaetano Massimo Pittalà & Michele Monno

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  1. Gaetano Massimo Pittalà
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  2. Michele Monno
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Correspondence to Gaetano Massimo Pittalà.

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Pittalà, G.M., Monno, M. 3D finite element modeling of face milling of continuous chip material. Int J Adv Manuf Technol 47, 543–555 (2010). https://doi.org/10.1007/s00170-009-2235-0

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  • DOI: https://doi.org/10.1007/s00170-009-2235-0

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