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Developing diffusion bonding windows for joining AZ31B magnesium and copper alloys

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Abstract

In this investigation, Mg–Cu dissimilar materials are joined by diffusion bonding process. The principal difficulty when joining Mg–Cu lies in the existence of hard-to-remove oxide films on the magnesium surfaces and the formation of brittle metallic interlayers and oxide inclusions in the bond region. In this investigation, an attempt was made to develop diffusion bonding windows for effective joining of AZ31B Magnesium and commercial grade copper alloys. Joints were fabricated using different combination of process parameters such as bonding temperature, bonding pressure and holding time. The bonding quality was checked by microstructure analysis and lap shear tensile test. Based on the results, diffusion bonding windows were constructed, and they are presented in this paper. These windows will act as reference maps for selecting appropriate diffusion bonding process parameters to get good quality bonds for Mg–Cu alloys.

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Authors and Affiliations

  1. Department of Mechanical Engineering, V. R. S College of Engineering and Technology, Arasur, 607 108, Tamil Nadu, India

    G. Mahendran

  2. Centre for Materials Joining and Research (CEMAJOR), Department of Manufacturing Engineering, Annamalai University, Annamalai Nagar, 608 002, Tamil Nadu, India

    V. Balasubramanian

  3. Department of Mechanical Engineering, Pondicherry Engineering College, Pondicherry, 605014, India

    T. Senthilvelan

Authors
  1. G. Mahendran
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  2. V. Balasubramanian
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  3. T. Senthilvelan
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Correspondence to V. Balasubramanian.

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Mahendran, G., Balasubramanian, V. & Senthilvelan, T. Developing diffusion bonding windows for joining AZ31B magnesium and copper alloys. Int J Adv Manuf Technol 42, 689–695 (2009). https://doi.org/10.1007/s00170-008-1645-8

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  • DOI: https://doi.org/10.1007/s00170-008-1645-8

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