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Applications of Taguchi and design of experiments methods in optimization of chemical mechanical polishing process parameters

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Abstract

This investigation applied the Taguchi method and designs of experiments (DOE) approach to optimize parameters for chemical mechanical polishing (CMP) processes in wafer manufacturing. Planning of experiments was based on a Taguchi orthogonal array table to determine an optimal setting. In this study, the material removal rate and non-uniformity of surface profiles were selected as the quality targets. This partial factorial experimental planning provided an efficient and systematic approach of determining an optimal parameter condition. Mathematical prediction models for the material removal rate and the non-uniformity of surface profiles were derived in terms of platen speeds, carrier speeds, back side pressure, slurry flow rates and head down forces by regression analysis. These parameters are found to be significant to both the removal rate and the non-uniformity of surface profiles for CMP processes.

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References

  1. Steigerwald JM, Murarka SP, Gutmann RJ (1997) Chemical mechanical planarization of microelectronic materials. Wiley, New York

    Google Scholar 

  2. Liu Y, Zhang K, Wang F, Di W (2003) Investigation on the final polishing slurry and technique of silicon substrate in ULSI. Microelectron Eng 66(1–4):438–444

    Article  Google Scholar 

  3. Lin ZC, Ho CY (2003) Analysis and application of grey relation and ANOVA in chemical-mechanical polishing process parameters. Int J Adv Manuf Technol 21:10–14

    Article  Google Scholar 

  4. Park SW, Kim CB, Kim SY, Seo YJ (2003) Design of experimental optimization for ULSI CMP process applications. Microelectron Eng 66:488–495

    Article  Google Scholar 

  5. Forsberg M (2005) Effect of process parameters on material removal rate in chemical mechanical polishing of Si(1 0 0). Microelectron Eng 77:319–326

    Article  Google Scholar 

  6. Wang G, Chou MH (2005) A neural-Taguchi-based quasi time-optimization control strategy for chemical-mechanical polishing processes. Int J Adv Manuf Technol 26:759–765

    Article  Google Scholar 

  7. Zhong ZW, Wang ZF, Zirajutheen BMP (2005) Chemical mechanical polishing of polycarbonate and poly meth1 methacrylate substrates. Microelectron Eng 81:117–124

    Article  Google Scholar 

  8. Zhong ZW, Wang ZF, Tan YH (2006) Chemical mechanical polishing of polymeric materials for MEMS applications. Microelectron J 37:295–301

    Article  Google Scholar 

  9. Kim NH, Choi MH, Kim SY, Chang EG (2006) Design of experiment (DOE) method considering interaction effect of process parameters for optimization of copper chemical mechanical polishing (CMP) process. Microelectron Eng 83:506–512

    Article  Google Scholar 

  10. Taguchi G (1990) Introduction to quality engineering. Asian Productivity Organization, Japan

    Google Scholar 

  11. Ross PJ (1996) Taguchi techniques for quality engineering, 2nd edn. McGraw-Hill, New York

    Google Scholar 

  12. Manna A, Bhattacharyya B (2004) Investigation for optimal parametric combination for achieving better surface finish during turning of Al/SiC-MMC. Int J Adv Manuf Technol 23:658–665

    Article  Google Scholar 

  13. Tosun N, Ozler L (2004) Optimization for hot turning operations with multiple performance characteristics. Int J Adv Manuf Technol 23:777–782

    Article  Google Scholar 

  14. Li MH, Hong SH (2005) Optimal parameter design for chip-on-film technology using the Taguchi method. Int J Adv Manuf Technol 25(7–8):777–782

    Google Scholar 

  15. Yang YK, Chang TC (2006) Experimental analysis and optimization of a photo resist coating process for photolithography in wafer fabrication. Microelectron J 37(8):746–751

    Article  MathSciNet  Google Scholar 

  16. Myers RH, Montgomery DC (2002) Response surface methodology, 2nd edn. Wiley, New York

    Google Scholar 

  17. Douglas CM (1997) Design and analysis of experiments, 4th edn. Wiley, New York

    MATH  Google Scholar 

  18. Minitab Inc., Quality Plaza, 1829 Pine Hall Road, State College, PA 16801–3008, USA

Download references

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Authors and Affiliations

  1. Department of Mechanical Engineering, Ming Hsin University of Science and Technology, 1, Hsin Hsing Road, Hsin Feng, 304, Hsinchu, Taiwan, Republic of China

    Hsin-Te Liao, Jie-Ren Shie & Yung-Kuang Yang

Authors
  1. Hsin-Te Liao
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  2. Jie-Ren Shie
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  3. Yung-Kuang Yang
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Correspondence to Yung-Kuang Yang.

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Liao, HT., Shie, JR. & Yang, YK. Applications of Taguchi and design of experiments methods in optimization of chemical mechanical polishing process parameters. Int J Adv Manuf Technol 38, 674–682 (2008). https://doi.org/10.1007/s00170-007-1124-7

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  • DOI: https://doi.org/10.1007/s00170-007-1124-7

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