Comparison of bonding procedures for 3D-structured polyimide films on silicon substrates applied to ink-jet cartridges

Abstract

Established bubble-jet printheads consist of an assembly of three layers, which are a CMOS substrate, a channel layer and a nozzle layer. The aim of the presented work was to simplify the setup of bubble-jet printheads by means of integrating channel and nozzle structures in one single three-dimensional laser-structured polyimide nozzle plate. Different bonding techniques for an assembly onto 1/3 inch standard CMOS printhead substrates are validated. The main challenges are a variety of bonding materials, an alignment accuracy of <5 μm and the prevention of blocking the 20 μm deep fluidic channels in the polyimide which have minimal lateral dimensions of 10 μm and a minimal pitch of 15 μm. In total, three bonding techniques, with and without additional adhesion layers, were developed and evaluated. One method applies a 4 μm thick layer of Epotec 353ND (Polytec), a standard two-component epoxy, in a specifically adapted rolling manner onto the film that is subsequently aligned to the silicon chip using a flip-chip-bonder. Screen-printing and dispensing processes of adhesives were investigated but failed due to insufficient structural resolution. The second method uses photolithographic processes to produce structured adhesion preforms in SU-8 resist. With a layer thickness of 3 μm and an adapted curing schedule, promising results concerning resolution and contour accuracy were obtained. Thirdly, bonding without additional adhesion layers was achieved in a micro-sealing process that takes advantage of the highly defined thermoplastic softening of polyimide KJ (DuPont). The different processes were compared regarding to yield, printing behavior of the assembled printheads and applicability to high volume productions. The hereby developed adhesion technology was applied on the assembly of large one inch printheads for special applications.