Abstract
In this paper, we developed a fast and robust machine vision system for wire bonding inspection. The defects caused by a bonding wire being broken, lost, shifted, shorted, or sagged in an integrated circuit (IC) chip can be inspected automatically. A new lighting environment was devised which will highlight the slope of the bonding wire and suppress the background from being extracted. First, a set of machine vision algorithms were designed to filter out the defects of broken wire, lost wire, shifted wire, and shorted-out wire. Second, the 3-D type defect of sagged wire can be detected by inspecting the change of the bonding wire slope, derived from a single 2-D image. Some illustrations are given to show the efficiency and effectiveness of the proposed novel wire bonding vision inspection system.
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Acknowledgment
This work is partly supported by the National Science Council of Taiwan, R.O.C., under contracts NSC 92-2213-E-009-103 and NSC 93-2213-E-009-038.
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Perng, DB., Chou, CC. & Lee, SM. Design and development of a new machine vision wire bonding inspection system. Int J Adv Manuf Technol 34, 323–334 (2007). https://doi.org/10.1007/s00170-006-0611-6
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DOI: https://doi.org/10.1007/s00170-006-0611-6