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Packaging using hot-embossing with a polymeric intermediate mould

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Abstract

Hot embossing allows the high precision replication of features from a mould insert into thermoplastic materials. The technique has been developed mainly for microsystem applications, in particular, the manufacture of micro-optical and micro-fluidic components and systems. It can also be applied to packaging applications. We developed a specific process based on a two-step replication process utilizing hot embossing and a rigid polymeric intermediate mould, which allows the manufacture of complex three-dimensional shapes to realize a functional optical package for optical microsystems.

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Authors and Affiliations

  1. Laboratoire FEMTO-ST, CNRS UMR 6174, Département LPMO, 32 Avenue de l’Observatoire, 25044, Besançon Cedex, France

    Chantal Khan Malek

  2. Centre de Transfert des Micro et Nanotechnologies (CTMN), 39 Avenue de l’Observatoire, B.P. 1445, 25007, Besançon Cedex 3, France

    Roland Duffait

Authors
  1. Chantal Khan Malek
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  2. Roland Duffait
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Correspondence to Roland Duffait.

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Khan Malek, C., Duffait, R. Packaging using hot-embossing with a polymeric intermediate mould. Int J Adv Manuf Technol 33, 187–190 (2007). https://doi.org/10.1007/s00170-006-0595-2

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  • DOI: https://doi.org/10.1007/s00170-006-0595-2

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