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A systematic approach to manufacturing packaging logistics

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Abstract

Packaging is one of the most important activities in the distribution systems and supply chains. Nevertheless, it attracts little attention of people, especially in the manufacturing sector because packaging has been intensively used as a protective agent only. One of the prime factors that inhibit manufacturing efficiency and productivity is treating packaging activities as an individual task. In other words, traditional packaging is usually considered as a cost driven center rather than a value added component throughout the manufacturing and distribution processes. If we reconsider the packaging design in a systematic approach, it is easy to develop more cost effective solutions for manufacturing processing that can support handling and distribution as well as providing protection of the product. By the same token, it will bring additional values to a company because of the improvement in manufacturing and distribution efficiency. The aim of the paper is to review and reorganize the major functions and roles of the packaging played in the manufacturing and logistics system and suggest a methodology for a systematic approach to packaging logistics. The proposed approach is demonstrated through a case study. How to transform an existing packaging system to the proposed one is also suggested.

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Author information

Authors and Affiliations

  1. Department of Industrial and Manufacturing Systems Engineering, The University of Kong Hong, Pokfulam Road, Hong Kong, Hong Kong

    F.T.S. Chan & H.K. Chan

  2. Department of Industrial and Systems Engineering, The Kong Hong Polytechnic University, Hung Hom, Hong Kong, Hong Kong

    K.L. Choy

Authors
  1. F.T.S. Chan
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  2. H.K. Chan
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  3. K.L. Choy
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Corresponding author

Correspondence to F.T.S. Chan.

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Chan, F., Chan, H. & Choy, K. A systematic approach to manufacturing packaging logistics. Int J Adv Manuf Technol 29, 1088–1101 (2006). https://doi.org/10.1007/s00170-005-2609-x

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  • DOI: https://doi.org/10.1007/s00170-005-2609-x

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