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Estimating chemical mechanical polishing pad wear with compressibility

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Abstract

A polishing pad is an important component in a chemical mechanical polishing (CMP) system. Few investigations have specialized in the variation of the characteristics of the pad as it undergoes wear. All of the information concerning a pad, such as compressibility and pad life, comes from the manufacturer. No acknowledged standard or instrument exists for determining a pad’s quality. This study obtained the variation of the compressibility (K) of major types of pad (single-layer pad and composite pad) with polishing time (pad wearing) by theoretical modeling and real experiments. The K of single-layer or composite pads changes due to wear, and the trends in the K values of the two types of pads are exactly opposite. A finite element method (FEM) is used here to show that the variation in K strongly affects the polishing process. Theoretically, the compressibility of a pad can be used to judge whether the pad is good for polishing or not.

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Acknowledgements

The authors would like to thank the National Science Council of the Republic of China for financially supporting this research under contract no. NSC-89-2212-E-007-013.

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Authors and Affiliations

  1. Department of Power Mechanical Engineering, National Tsing Hua University, 101 Section 2 Kuang-Fu Road, Hsinchu, Taiwan, 30013, People’s Republic of China

    Pei-Lum Tso & Rick Hsu

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  1. Pei-Lum Tso
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  2. Rick Hsu
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Correspondence to Pei-Lum Tso.

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Tso, PL., Hsu, R. Estimating chemical mechanical polishing pad wear with compressibility. Int J Adv Manuf Technol 32, 682–689 (2007). https://doi.org/10.1007/s00170-005-0386-1

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  • DOI: https://doi.org/10.1007/s00170-005-0386-1

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