Abstract
For ductile mode cutting of brittle materials, such as silicon wafers, the undeformed chip thickness has to be smaller than the tool edge radius. In practical application, for high production rate, the undeformed chip thickness is expected to be as large as possible. Therefore, the tool edge radius is expected to be as large as possible. In this study, the upper bound of the tool edge radius is investigated through cutting experiments.
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Arefin, S., Li, X.P., Rahman, M. et al. The upper bound of tool edge radius for nanoscale ductile mode cutting of silicon wafer. Int J Adv Manuf Technol 31, 655–662 (2007). https://doi.org/10.1007/s00170-005-0245-0
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DOI: https://doi.org/10.1007/s00170-005-0245-0