Abstract
Today, market demand for smaller, more powerful consumer electronics is rapidly posing a major challenge to product design. Several issues have been identified as major factors that affect the quality, cost, and delivery of product design in the so-called distributed design project. To address these concerns, a structured design method is needed. This paper proposes a design framework that can moderate inconsistent performance of system components (modules) resulting from a lack of communication between design sites. Module interconnection parameters at a system level are determined using the behavior-coupling matrix and work distribution matrix; initial design target values (ITVs) for system boundary conditions are provided for each module design. Our results show that system decomposition using ITVs offers a suitable framework for designing a product, considering the overall system behavior where each module is independently designed at different locations.
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References
Baldwin CY, Clark KB (2000) Design rules, vol 1: The power of modularity. The MIT press, Massachusetts
Chen C, Hodes M, Manzione L (2001) Sizing of heat spreaders above dielectric layers. J Electron Packag 123(3):173+. doi:10.1115/1.1377271
Choi J, Kim Y, Sivasubramaniam A, Srebric J, Wang Q, Lee J (2007) Modeling and managing thermal profiles of rack-mounted servers with thermostat. In: IEEE 13th international symposium, pp 205–215. doi:/10.1109/HPCA.2007.346198
Cong J, Wei J, Zhang Y (2004) A thermal-driven floor planning algorithm for 3d ics. In: Computer aided design. ICCAD-2004. IEEE/ACM international conference, pp 306–313. http://ieeexplore.ieee.org/xpls/absall.jsp/arnumber=1382591
Eppinger S, Cho S (2001) Product development process modeling using advanced simulation. In: Proceedings of the ASME DETC (DETC2001/DTM-21691)
Eppinger D, Whitney E, Smith R, Gebala D (1990) Organizing the tasks in complex design projects. In: Proceedings of the ASME DTM, vol DE-27, pp 39–49
Esterman M, Ishii K (2005) The development of project risk metrics for robust concurrent product development (CPD) across the supply chain. Concurr Eng 13(2):85–94. doi:10.1177/1063293X05053792
Forsberg K, Mooz H, Cotterman H (2005) Visualizing project management: models and frameworks for mastering complex systems. J Wiley. http://www.worldcat.org/isbn/0471648485
Greiner M, Warga J, Braun T (2007) Complexity management using multiple-domain mapping—development of high pressure pumps for common rail systems. In: 9th International design structure matrix conference, DSM’07, 2007, Munich, Germany
Hayashi S, Iwata Y, Fujimoto K, Satoh R (2005) Collaborated design between thermal design and circuit design based on boundary conditions between modules. J Inst Electron Inf Commun Eng 88(11):972–980
Jung E, Wojakowski D, Neumann A, Aschenbrenner R, Reichl H (2003) Three dimensional packaging of bare IC into printed circuit boards for SIP. In: Proceedings of IMECE ASME
Kimber M, Suzuki K, Kitsunai N, Seki K, Garimella SV (2009) Pressure and flow rate performance of piezoelectric fans. Components Packag Technol IEEE Trans, 99. doi:10.1109/TCAPT.2008.2012169
Leung P, Ishii K, Abell J, Benson J (2008) Distributed system development risk analysis. J Mech Des 130(5):051403+. doi:10.1115/1.2885196
Lindemann U, Maurer M, Braun T (2005) Structural complexity management. Springer, Berlin, ISBN:978-3-540-87888-9
Mori T, Ishii K, Kondo K, Ohtomi K (1999) Task planning for product development by strategic scheduling of design reviews. In: Proceedings of DETC ASME
Rencz M (2005) Thermal issues in stacked die packages. In: Semiconductor thermal measurement and management symposium, IEEE twenty first annual IEEE, pp 307–312. doi:10.1109/STHERM.2005.1412197
Sosa M, Eppinger S, Rowles C (2003) Identifying modular and integrative systems and their impact on design team interactions. J Mech Des 125(2):240. doi:10.1115/1.1564074
Sosa M, Eppinger S, Rowles C (2004) The misalignment of product architecture and organizational structure in complex product development team interactions. Manage Sci 50(12):1674. doi:10.1287/mnsc.1040.0289
Ulrich KT, Eppinger SD (2007) Product design and development. McGraw-Hill, New York, ISBN:978-07-310142-2
Acknowledgments
This work was supported in part by a Grant-in-Aid from the Global Center of Excellence Program for the “Center for Education and Research of Symbiotic, Safe, and Secure System Design” from the Ministry of Education, Culture, Sport, and Technology in Japan. We also gratefully acknowledge the assistance of Prof. Kos Ishii, Stanford University. Prof. Ishii reviewed the initial manuscript of this paper and decided to submit it to Research in Engineering Design, but unfortunately, he passed away before the actual submission. We are thankful to Prof. Ishii for his advice and unconventional and inclusive way of thinking for design research. We would also like to thank Dr. Laurent Balmelli of IBM Software Group for his kind help and instruction. We also acknowledge Dr. Sun Kim and the Manufacturing Modeling Laboratory at Stanford University for their continuous support and discussions in this research.
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Seki, K., Nishimura, H. A module-based thermal design approach for distributed product development. Res Eng Design 22, 279–295 (2011). https://doi.org/10.1007/s00163-011-0113-x
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DOI: https://doi.org/10.1007/s00163-011-0113-x