Abstract
For the optimization design of the thermoelastic structures in transient heat transfer, the commonly used design methods in previous studies which transforms the transient heat transfer into a steady-state heat transfer could result in significant inaccuracy in the analysis and design of the thermoelastic structure. This study presents a topology optimization method for thermoelastic structures under transient thermal loads considering thermal stress constraints to realize the accurate optimization and effective stress control of transient thermoelastic structures. Condensed integrals in the time and space domains are used to approximately represent the maximum temperature and thermal stress. Two optimization models are proposed. One is to minimize the weighted sum of the dimensionless strain energy and the maximum temperature with a material volume constraint, and the other is to minimize the strain energy with constraints on the maximum stress and material volume. The temperature field and elastic responses are obtained by solving the transient thermal conductive equations and thermoelastic equations. The adjoint method is used to derive the sensitivity expressions. Three numerical examples are provided to illustrate the effectiveness and necessity of the proposed method. The results showed that to realize the accurate design of transient thermoelastic structures, it is necessary for the adopted design method to accurately reflect the influence of the transient effects on the structural response, while the method proposed in this paper can achieve this.
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Acknowledgements
The authors gratefully acknowledge the financial support to this work by the National Natural Science Foundation of China (Grant Nos. U1808215, 11972105), the 111 Project (B14013) and the Fundamental Research Funds for the Central Universities of China (DUT21GF101).
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Li, S., Zhang, Y., Liu, S. et al. Topology optimization of thermoelastic structures under transient thermal loads limited to stress constraints. Struct Multidisc Optim 66, 9 (2023). https://doi.org/10.1007/s00158-022-03406-7
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DOI: https://doi.org/10.1007/s00158-022-03406-7