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Investigation of the physical and mechanical properties of lightweight particleboard bonded by foamable polyurethane adhesive

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Abstract

The objective of this study was to investigate the manufacture process and basic properties of particleboard using foamable polyurethane adhesive. The foaming and curing behaviors of the polyurethane adhesive were analyzed using differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). The PressMAN hot-pressure monitoring system was used to obtain the internal temperature and gas pressure in the mat during the hot-pressing process. The effects of the hot-pressing temperature, time and mat structure on the physical and mechanical properties of lightweight particleboard were investigated to optimize the process parameters. Results showed that the peak foaming and curing temperatures of the polyurethane adhesive were around 75 °C and 95 °C, respectively. The core layer temperature of the particleboard reached the required temperature for foaming and curing when hot pressing. The lightweight particleboard that was hot-pressed at 180 °C for 5 min had a density of 0.5 g/cm3. At a mass ratio of the surface layer to the core layer of 1:3, the lightweight particleboard exhibited a good vertical density profile, as well as excellent mechanical properties. This study demonstrates that lightweight particleboard can be successfully fabricated using foamable polyurethane adhesive without free formaldehyde release.

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Availability of data and materials

The datasets used and/or analyzed during the current study are available from the corresponding author on reasonable request.

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Funding

This work was financially supported by the National Key Research and Development Program of China (2018YFD0600301).

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Conceptualization, JW; Methodology, JW, TH, FL, LS and JL; Validation, JW; Formal analysis, JW; Investigation, JW; Resources, JW; Data curation, JW; Writing—original draft preparation, JW; Writing—review & editing, JW, TH, FL, LS, JL and ZT; Visualization, JW; Supervision, JW; Project administration, JW; Funding acquisition, JW.

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Correspondence to Junfeng Wang.

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Wang, J., Huang, T., Lei, F. et al. Investigation of the physical and mechanical properties of lightweight particleboard bonded by foamable polyurethane adhesive. Eur. J. Wood Prod. 80, 213–222 (2022). https://doi.org/10.1007/s00107-021-01744-9

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  • DOI: https://doi.org/10.1007/s00107-021-01744-9

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