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Semiempirical Model for IC Interconnects Considering the Coupling Between the Signal Trace and the Ground Plane

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Abstract

A semiempirical, piecewise-defined, and physical model for integrated circuit interconnects is presented. The proposed model accurately represents the corresponding frequency-dependent resistance, and self- and mutual inductances while also accounting for the eddy currents induced in the ground metal layer. For the model implementation, different frequency regions where the resistance, and the self- and mutual inductances exhibit different trends due to the variation in the effective area where the current is flowing are identified, as well as the corresponding transitional frequencies. Experimental results performed to on-chip test structures fabricated on an RF-CMOS technology are used to validate the proposed model up to 40 GHz.

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Authors and Affiliations

  1. Department of Electronics, Instituto Nacional de Astrofísica, Óptica y Electrónica (INAOE), Luis Enrique Erro No. 1, 72000, Santa. María Tonantzintla, Puebla, México

    Mónico Linares-Aranda, Diego M. Cortés-Hernández & Reydezel Torres-Torres

  2. Board Development, Intel Tecnología de México, Avenida del Bosque 1001, 45019, Zapopan, Jalisco, México

    Oscar González-Díaz & Diego M. Cortés-Hernández

Authors
  1. Mónico Linares-Aranda
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  2. Oscar González-Díaz
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  3. Diego M. Cortés-Hernández
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  4. Reydezel Torres-Torres
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Correspondence to Mónico Linares-Aranda.

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Linares-Aranda, M., González-Díaz, O., Cortés-Hernández, D.M. et al. Semiempirical Model for IC Interconnects Considering the Coupling Between the Signal Trace and the Ground Plane. Circuits Syst Signal Process 37, 3888–3902 (2018). https://doi.org/10.1007/s00034-017-0742-z

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  • DOI: https://doi.org/10.1007/s00034-017-0742-z

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