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Dual-beam ablation of fused silica by multiwavelength excitation process using KrF excimer and F2 lasers

Abstract.

A new technique of dual-beam laser ablation of fused silica by multiwavelength excitation process using a 248-nm KrF excimer laser (ablation beam) coupled with a 157-nm F2 laser (excitation beam) in dry nitrogen atmosphere is reported. The dual-beam laser ablation greatly reduced debris deposition and, thus, significantly improved the ablation quality compared with single-beam ablation of the KrF laser. High-quality ablation can be achieved at the delay times of KrF excimer laser irradiation shorter than 10 ns due to a large excited-state absorption. The ablation rate can reach up to 80 nm/pulse at the fluence of 4.0 J/cm2 for the 248-nm laser and 60 mJ/cm2 for the F2 laser. The ablation threshold and effective absorption coefficient of KrF excimer laser are estimated to be 1.4 J/cm2 and 1.2×105 cm-1, respectively.

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Received: 13 February 2000 / Accepted: 28 March 2000 / Published online: 7 June 2000

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Zhang, J., Sugioka, K., Takahashi, T. et al. Dual-beam ablation of fused silica by multiwavelength excitation process using KrF excimer and F2 lasers . Appl Phys A 71, 23–26 (2000). https://doi.org/10.1007/PL00021086

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  • PACS: 42.60; 81.60