Skip to main content
Log in

Copper-silica and copper-alumina alloys of high temperature interest

  • Published:
JOM Aims and scope Submit manuscript

Abstract

Utilizing relatively coarse copper powders and several sizes of silica and alumina powders, alloys containing up to 10 volume pct of oxide were made. The alloys were prepared by mechanical mixing of powders, followed by cold hydrostatic pressing, sintering, and hot extrusion. Measurements were made of room temperature tensile properties, recrystallization temperature, creep rupture properties from 250° to 450°C, and resistivity. In addition, metallographic studies were made of the resultant structures. Of particular interest was the stability of the structure with respect to temperature, time, and stress.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Similar content being viewed by others

References

  1. R. Irman: Sintered Aluminum with High Strength at Elevated Temperatures. Metallurgica, 1952, vol. 46, No. 275, pp. 125–133.

    Google Scholar 

  2. E. Gregory and N. J. Grant: High Temperature Strength of Wrought Aluminum Powder Products. AIME Trans, 1954, vol. 200, pp. 247-252; Journal of Metals, February 1954.

    Google Scholar 

  3. N. J. Grant and O. Preston: Dispersed Hard Particle Strengthening of Metals. AIME Trans, 1957, vol. 209, pp. 349-360; Journal of Metals, March 1957.

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Additional information

TP 4588E. Manuscript, Nov. 13, 1956.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Zwilsky, K.M., Grant, N.J. Copper-silica and copper-alumina alloys of high temperature interest. JOM 9, 1197–1201 (1957). https://doi.org/10.1007/BF03398288

Download citation

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/BF03398288

Navigation