Skip to main content
SpringerLink
Log in

Moulding technology for electronic components

  • Materials
  • Published:
AutoTechnology

Abstract

There has been a great increase in the importance of polyamide hotmelt adhesives, particularly over the last 20 years. This product group has been in use for several years for sealing electrical components in the automotive sector. Henkel recognizes the importance of these products in providing protection for printed circuit boards and electronics in vehicle electrical systems.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

Reference

  1. DIN 51005, Thermal analysis (TA) terms.

  2. DIN 53765, Testing of plastics and elastomers; Thermal analysis; DSCmethod.

  3. Heucher, R.; Filz, P.: Wasserdichte Autoelektronik, Kunststoffe 82 (1992) 9, S.825–829.

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Henkel, Germany

    Bettina Becker & Achim Schoeneweiss

Authors
  1. Bettina Becker
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Achim Schoeneweiss
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

About this article

Cite this article

Becker, B., Schoeneweiss, A. Moulding technology for electronic components. AutoTechnol 7, 34–37 (2007). https://doi.org/10.1007/BF03246994

Download citation

  • Issue Date:

  • DOI: https://doi.org/10.1007/BF03246994

Keywords

Search

Navigation