Ceramic simplifies heat dissipation

Abstract

LEDs suffer heat problems limiting their success as a light source. Much attention is given to the heatsink, less to the layers and barriers between LED and the heat dissipating surface. A change of concept and material allows significant gains in thermal management and reliability as well as a simplified system. Using ceramics as heatsink, circuit carrier and part of the product design needs some fresh thinking and the willingness to overcome traditional patterns. A simulation method based on Computational Fluid Dynamics supports thermal optimization and technical product design. Altair and Ceramtec explain the theoretical approach, the proof of concept and what and how improvement with ceramic heatsinks can be achieved. In this cases the OEM get various knowledge from the industry solutions.