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The properties of tin-bismuth alloy solders

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Abstract

Tin-bismuth alloys may be an alternative to lead-based solders for low-temperature applications, but very little is known about their manufacturability and reliability. This article presents an overview of these issues. First, experiments to determine the wetting properties of the Sn-Bi solder are presented. The results show that Sn-Bi solders do not wet bare copper well, but that they do wet copper having a hot-dipped Sn-Bi coating. Next, the effects of aging on the microstructure of Sn-Bi solders are described. The results show that during aging, tin is de-pleted from the solder/base metal interface. The two-phase Sn-Bi microstructure coarsens during aging; the rate of coarsening can be slowed by adding 1.0 wt. % Cu to the solder. The aging also affects the shear strength of the solder joints, where aged joints show an increase in maximum shear stress and ductility at failure.

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References

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Authors and Affiliations

  1. Design and Manufacturing Institute, Rensselaer Polytechnic Institute, USA

    Lawrence E. Felton Ph.D. (project manager)

  2. Design and Manufacturing Center, Rensselaer Polytechnic Institute, USA

    Christopher H. Raeder M.S. (research assistant)

  3. Materials Engineering Department, Rensselaer Polytechnic Institute, USA

    David B. Knorr Sc.D. (associate professor, member of TMS)

Authors
  1. Lawrence E. Felton Ph.D.
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  2. Christopher H. Raeder M.S.
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  3. David B. Knorr Sc.D.
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Felton, L.E., Raeder, C.H. & Knorr, D.B. The properties of tin-bismuth alloy solders. JOM 45, 28–32 (1993). https://doi.org/10.1007/BF03222377

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