Abstract
Conventional thick film conductors rely for their adhesion on the formation of a glassy layer which keys them both chemically and mechanically to the substrate surface. A newer type of conductor contains no glass frit but is reactively-bonded to the substrate, resulting in different properties which may be advantageous for certain applications. This article is based upon a contribution presented to the International Hybrid Microelectronics Society’s European Conference held at Bad Homburg, West Germany, in May.
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References
L. Hailes and W. A. Crossland,Int. Eke. Pack. Prod., July 1972, 25
M. V. Coleman,Radio Electron. Eng., 1975,45, (3), 121
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Coleman, M.V., Gurnett, G.E. Gold thick film conductors. Gold Bull 10, 74–75 (1977). https://doi.org/10.1007/BF03215436
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DOI: https://doi.org/10.1007/BF03215436