Abstract
Thin film and thick film circuits represent two important and high volume applications of gold in the electronics industry. This article reviews the techniques used in these fields by one major manufacturer to meet the requirements of high performance, small size and reliability.
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References
E. E. Smith and S. G. Ayling, Sputtered Dielectric Capacitors, 1962 Electronic Components Conference, Washington, U.S.A.
S. G. Ayling, T. A. Askwith and M. Tarr, The Manufacture of Close Tolerance Miniature Silica Film Dielectric Capacitors, Inter-Nepcon 1971
R. G. Finch, Gold in Thick Film Hybrid Microelectronics, Gold Bulletin, 1972, 5, (2), 26
W. A. Crosland and L. Hailes, Thick Film Conductor Adhesion Reliability, Solid State Technol., 1971, 42
P. C. G. Nolan, Resin Attachment of Semiconductor Dice on to Film Circuits, Microelectrics and Reliability, 1973, 12, pp. 235–241
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Russell, R.F. Gold in hybrid microelectronics. Gold Bull 7, 30–34 (1974). https://doi.org/10.1007/BF03215031
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DOI: https://doi.org/10.1007/BF03215031