Electroplated gold in microwave integrated circuits

Abstract

The number of microwave integrated circuit substrates required for military, aerospace and satellite purposes is growing steadily. The conductive interconnections on these substrates must be of very pure gold. In this article, a process for producing such gold interconnections on substrates, which has been found reliable and adaptable to a wide range of substrate materials, is outlined. Particular attention is given to the critical gold-electrodeposition stage.