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Evaluation of thermal deformation in electronic packages

  • Thermal Engineering · Fluid Engineering · Energy and Power Engineering
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Abstract

Thermal deformation in an electronic package due to thermal strain mismatch is investigated. The warpage and the in-plane deformation of the package after encapsulation is analyzed using the laminated plate theory. An exact solution for the thermal deformation of an electronic package with circular shape is derived. Theoretical results are presented on the effects of the layer geometries and material properties on the thermal deformation. Several applications of the exact solution to electronic packaging product development are illustrated. The applications include lead on chip package, encapsulated chip on board and chip on substrate.

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Authors and Affiliations

  1. Department of Mechanical Engineering, College of Engineering, Chonnam National University, 300 Yongbong-dong, 500-757, Kwangju, Korea

    Hyeon Gyu Beom & Kyoung Moon Jeong

Authors
  1. Hyeon Gyu Beom
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  2. Kyoung Moon Jeong
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Correspondence to Hyeon Gyu Beom.

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Beom, H.G., Jeong, K.M. Evaluation of thermal deformation in electronic packages. KSME International Journal 14, 251–260 (2000). https://doi.org/10.1007/BF03184791

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  • DOI: https://doi.org/10.1007/BF03184791

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