Abstract
Silicon nitride coatings were deposited on hard metals at a reaction temperature between 873 and 1173 K by a plasma-enhanced chemical vapour deposition process operating with an r.f. discharge. The dependence of the coatings on the process parameters (deposition temperature and d. power) was investigated, in respect of phase composition, impurities in the coatings, metallographic appearance, microhardness, adhesion and layer-substrate interaction. It was found that upto a deposition temperature of 1023 K the coatings were amorphous. Above 1023 K the coatings increasingly contained crystalline regions. At 1173 K and an d. power above 200 W, the coatings were nearly completely crystalline.
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R. S. ROSLER,Solid State Technol. 22 (1979) 88.
Y. RON, A. RAVEH, U. CARMI, A INSPEKTOR and R. AVNI,Thin Solid Films 107 (1983) 181.
M. FUKUTOMI, M. KITAJIMA, M OKADA and R. WATANABE,J. Electrochem. Soc. 124 (1977) 1420.
K KIJIMA, N. SETAKA and H. TANAKA,J. Crystal Growth 24/25 (1974) 183.
W. SCHINTLMEISTER, W. WALLGRAM and K. GIGL, in “Proceedings of the 11th International Plansee Seminar 1985”, Reutte, Tirol, Austria, 1985, edited by H. Bildstein, H. M. Ortner (Metallwerk Plansee, GMBH, 1985), Vol. 2, p.299.
A LEONHARDT, Z Arbeitstagungder Chemischen Gasellochaft der DDR, Arbeitsgemeinschaft Festkörchemie, Bad Schandan, 1984, in Wiss. Berichte Zentralinstitut für Festkörperphysik und Werkstofforschung Dresden, no. 28, 1984, p. 17.
H. H SAWIN,Solid State Technol. 28 (1985) 211.
T. L CHU, C. H. LEE and B. A. GRUBER,J. Electrochem. Soc. 114 (1967) 717.
C GRESKOVICH and G E GAZZA,J. Mater. Sci Lett. 4 (1985) 195.
K. NIIHARA and T. HIRAI,J. Mater. Sci. 12 (1977) 1243.
D SCHALCH, A SCHARMANN and R WOLFRAT,Thin Solid Films 124 (1985) 301.
D SCHALCH, A SCHARMANN and R WOLFRAT, Ibid.155 (1987) 301.
N WADA, S A SOLIN, J. WONG and S PROCHAZKA,J. Non-Cryst. Solids 43 (1981) 7.
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Endler, I., Leonhardt, A., Schönherr, M. et al. Plasma-enhanced chemical vapour deposition of silicon nitride from SiCl4, nitrogen and hydrogen on hard metals. J Mater Sci 26, 782–786 (1991). https://doi.org/10.1007/BF03163522
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DOI: https://doi.org/10.1007/BF03163522