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The structure and growth of nickel electrodeposits on electropolished copper single-crystal substrates

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Abstract

An exploratory study has been made of the orientation and growth of nickel electrodeposits on copper (110) and (111) substrates. The general nature of the variation of deposit structure with current density and thickness has been elucidated, and the results compared with previous work involving a deposit-substrate pair, where both metals belong to the f.c.c. system.

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Author notes

  1. A. K. N. Reddy (Post-doctoral Research Associate)

    Present address: Electrochemistry Laboratory, University of Pennsylvania, Philadelphia 4, Pa.

Authors and Affiliations

  1. Applied Physical Chemistry of Surfaces Laboratory, Chemical Engineering Department, Imperial College of Science and Technology, S.W. 7, London, England

    A. K. N. Reddy (Post-doctoral Research Associate) & H. Wilman

Authors
  1. A. K. N. Reddy
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  2. H. Wilman
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Additional information

Communicated by Dr. S. Ramaseshan,f.a.sc.

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Reddy, A.K.N., Wilman, H. The structure and growth of nickel electrodeposits on electropolished copper single-crystal substrates. Proc. Indian Acad. Sci. 61, 34–40 (1965). https://doi.org/10.1007/BF03049235

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  • DOI: https://doi.org/10.1007/BF03049235

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