Skip to main content
SpringerLink
Log in

An interpretation of the failure paths of roughened metal/polymerinterfaces

  • Published:
Metals and Materials International Aims and scope Submit manuscript

Abstract

Roughening of metal surfaces enhances the adhesion strength of metal to polymer by mechanical interlocking and this often produces cohesive failure. In a previous work [1], an adhesion study on a roughened metalpolymer system was carried out, and the correlation between adhesion strength and failure path was investigated. In the present work, the correlation between failure path and microstructure of metal surfaces before molding was studied. The results showed that the variation in failure path could be explained by introducing a simple adhesion model developed from the theory of the fiber reinforcement of composite materials. It is believed that this model can be extended to other similarly roughened metal-polymer systems.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. H. Y. Lee,Metals and Materials 6, 317 (2000).

    Article  ADS  CAS  Google Scholar 

  2. I. Fukuzawa, S. Ishiguro and S. Nanbu,Proc. 23rd Int. Reliab. Phys. Symp., p. 192 (1985).

  3. S. Omi, K. Fujita, T. Tsuda and T. Maeda,Proc. 41st Electron. Comp. Tech. Conf., p. 766 (1991).

  4. L. T. Nguyen,ASME J. Electron. Packag. 115, 346 (1993).

    Article  Google Scholar 

  5. C. Lee, W. Hösler, H. Cerva, R. von Criegern and A. Parthasarathi,IEEE Trans. Adv. Packag. 22, 398 (1999).

    Article  CAS  Google Scholar 

  6. C. Lee, T. C. Wong and H. Pape,Proc. 46th Electron. Comp. Tech. Conf., p. 78 (1996).

  7. A. Altimari, S. Golwalkar, P. Boysan and R. Foehringer,Proc. 42nd Electron. Comp. Tech. Conf., p. 945 (1992).

  8. O. Yoshioka, N. Okabe, S. Nagayama, R. Yagagishi and G. Murakami,Proc. 39th Electron. Comp. Tech. Conf., p. 464 (1989).

  9. J. M. Park and J. P. Bell,Epoxy Adhesion to Copper, in Adhesion Aspects of Polymeric Coatings (ed., K. L. Mittal), p. 205, Plenum, New York (1983).

    Google Scholar 

  10. G. Xue, G. Shi, J. Ding, W. Chang and R. Chen,J. Adhesion Sci. Tech. 4, 723 (1990).

    Article  CAS  Google Scholar 

  11. H. Ohsuga, H. Suzuki, T. Aihara and T. Hamano,Proc. 44th Electron. Comp. Tech. Conf., p. 141 (1994).

  12. F. Djennas, E. Prack and Y. Matsuda,IEEE Trans. Comp. Hybrids Manufact. Tech. 16, 919 (1993).

    Article  CAS  Google Scholar 

  13. G. S. Ganesan, G. L. Lewis, T. Anderson and H. M. Berg,Proc. 46th Electron. Comp. Tech. Conf., p. 68 (1996).

  14. K. K. Chawla,Composite Materials, p. 383, Springer-Verlag New York, Inc. (1998).

    Google Scholar 

  15. H. Y. Lee and Jin Yu,J. Electronic Mater. 28, 1444 (1999).

    Article  ADS  CAS  Google Scholar 

  16. R. S. Krishnan, R. Srinivasan and S. Devanarayanan,Thermal Expansion of Crystals, p. 176, Pergamon Press (1979).

  17. A. Kelly and G. J. Davies,Metall. Rev. 10, 1 (1965).

    CAS  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Packaging Research Center, Georgia Institute of Technology, 813 Ferst Drive, NW, 30332-0506, Atlanta, GA, U.S.A.

    Ho-Young Lee & Jianmin Qu

Authors
  1. Ho-Young Lee
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Jianmin Qu
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

About this article

Cite this article

Lee, HY., Qu, J. An interpretation of the failure paths of roughened metal/polymerinterfaces. Met. Mater. Int. 7, 101–105 (2001). https://doi.org/10.1007/BF03026947

Download citation

  • Issue Date:

  • DOI: https://doi.org/10.1007/BF03026947

Keywords

Search

Navigation